CY9AFB42NBBGL-GK9E1

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Mfr.Part #
CY9AFB42NBBGL-GK9E1
Manufacturer
Infineon Technologies
Package / Case
112-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 160KB FLASH 112BGA
Stock
25,187
In Stock :
25,187

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Manufacturer :
Infineon Technologies
Product Category :
Microcontrollers
Speed :
40MHz
Core Processor :
ARM® Cortex®-M3
Core Size :
32-Bit Single-Core
Voltage - Supply (Vcc/Vdd) :
1.65V ~ 3.6V
Series :
FM3 MB9AB40NB
Operating Temperature :
-40°C ~ 85°C (TA)
Program Memory Size :
160KB (160K x 8)
Supplier Device Package :
112-PFBGA (10x10)
Package :
Tray
Product Category :
ARM Microcontrollers - MCU
Packaging :
Tray
RAM Size :
16K x 8
RoHS :
Details
Data Converters :
A/D 24x12b
EEPROM Size :
-
Base Product Number :
CY9AFB42
Subcategory :
Microcontrollers - MCU
Mounting Type :
Surface Mount
Product Status :
Active
Package / Case :
112-LFBGA
Program Memory Type :
Flash
Oscillator Type :
Internal
Brand :
Infineon Technologies
Manufacturer :
Infineon
Peripherals :
DMA, LCD, LVD, POR, PWM, WDT
Product Type :
ARM Microcontrollers - MCU
Number of I/O :
83
Datasheets
CY9AFB42NBBGL-GK9E1
Introducing Microcontrollers Infineon Technologies CY9AFB42NBBGL-GK9E1 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 85°C (TA), Mounting Type:Surface Mount, Package / Case:112-LFBGA, CY9AFB42NBBGL-GK9E1 pinout, CY9AFB42NBBGL-GK9E1 datasheet PDF, CY9AFB42NBBGL-GK9E1 amp .Beyond Microcontrollers Infineon Technologies CY9AFB42NBBGL-GK9E1 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY9AFB42NBBGL-GK9E1


Microcontrollers Infineon Technologies CY9AFB42NBBGL-GK9E1 Overview

The Microcontrollers Infineon Technologies CY9AFB42NBBGL-GK9E1 is a high-performance, 32-bit microcontroller unit (MCU) designed for advanced embedded applications. Equipped with 160KB of flash memory and housed in a compact 112BGA package, this MCU is engineered to deliver robust performance with low power consumption. The integration of sophisticated features and connectivity options makes the CY9AFB42NBBGL-GK9E1 an ideal choice for designers seeking to develop advanced systems in demanding sectors. Its versatility is matched by its reliability, provided by leading-edge technology from Infineon Technologies, making it an essential component in any high-tech integration.

CY9AFB42NBBGL-GK9E1 Features

The CY9AFB42NBBGL-GK9E1 MCU boasts numerous features that enhance its utility in complex electronic environments. Key features include a 32-bit processing core for efficient data handling, 160KB of onboard flash memory for ample program storage, and a 112-ball grid array (BGA) package that ensures a minimal footprint on system boards. Additional features such as advanced security protocols, multiple communication interfaces, and low-power operation modes make it highly adaptable to a variety of applications.

CY9AFB42NBBGL-GK9E1 Applications

  • Automotive Systems: This MCU can be integrated into engine control units, providing precise management and diagnostics capabilities in automotive applications.
  • Industrial Automation: Suitable for use in process controllers and automation systems, the CY9AFB42NBBGL-GK9E1 facilitates enhanced process efficiency and reliability.
  • Smart Home Devices: Enables smart connectivity and control for home automation systems, improving user interfaces and energy efficiency.
  • Wearable Technology: Its compact size and power efficiency make it ideal for wearable health monitoring devices, offering long battery life and robust performance.
  • Internet of Things (IoT) Devices: Perfect for IoT applications requiring connectivity and data processing capabilities, such as smart sensors and networked appliances.
This HTML content provides a comprehensive overview, feature list, and detailed applications for the Infineon Technologies CY9AFB42NBBGL-GK9E1 microcontroller, focusing on attracting B2B customers and highlighting the MCU's versatility and efficiency in various advanced technological implementations.
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