CY9AF114NABGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

DAC Channels :

No

ROM (words) :

262144

Number of I/O :

83

JESD-30 Code :

S-PBGA-B112

Speed :

40MHz

Terminal Pitch :

0.8mm

Supply Voltage-Min (Vsup) :

2.7V

Packaging :

Tray

Core Size :

32-Bit

Height Seated (Max) :

1.45mm

Length :

10mm

Supply Voltage-Max (Vsup) :

5.5V

Surface Mount :

yes

Mounting Type :

Surface Mount

Has ADC :

yes

Factory Lead Time :

19 Weeks

Operating Temperature :

-40°C~105°C TA

RAM Size :

32K x 8

PWM Channels :

yes

Bit Size :

32

On Chip Program ROM Width :

8

Terminal Form :

Ball

Terminal Position :

BOTTOM

Core Processor :

ARM® Cortex®-M3

Package / Case :

112-LFBGA

RoHS Status :

ROHS3 Compliant

Data Converter :

A/D 16x12b

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Number of Terminations :

112

Program Memory Size :

256KB 256K x 8

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Address Bus Width :

25

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

DMA Channels :

yes

Peripherals :

DMA, LVD, POR, PWM, WDT

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Oscillator Type :

Internal

Program Memory Type :

Flash

RAM (bytes) :

32768

External Data Bus Width :

16

Series :

FM3 MB9A110A

Width :

10mm

Connectivity :

CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART

Clock Frequency :

48MHz