CY9AF112NABGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

Supply Voltage-Min (Vsup) :

2.7V

Width :

10mm

Program Memory Type :

Flash

Program Memory Size :

128KB 128K x 8

Address Bus Width :

25

Supply Voltage-Max (Vsup) :

5.5V

On Chip Program ROM Width :

8

Package / Case :

112-LFBGA

DMA Channels :

yes

Core Size :

32-Bit

Speed :

40MHz

External Data Bus Width :

16

Connectivity :

CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART

PWM Channels :

yes

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Mounting Type :

Surface Mount

Series :

FM3 MB9A110A

Oscillator Type :

Internal

Terminal Pitch :

0.8mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

ROM (words) :

131072

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Packaging :

Tray

Data Converter :

A/D 16x12b

Length :

10mm

Number of Terminations :

112

Surface Mount :

yes

Clock Frequency :

48MHz

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Number of I/O :

83

RAM Size :

16K x 8

JESD-30 Code :

S-PBGA-B112

Height Seated (Max) :

1.45mm

Core Processor :

ARM® Cortex®-M3

RAM (bytes) :

16384

Factory Lead Time :

19 Weeks

Peripherals :

DMA, LVD, POR, PWM, WDT

DAC Channels :

No

Has ADC :

yes

Operating Temperature :

-40°C~105°C TA

Bit Size :

32

Terminal Form :

Ball

RoHS Status :

ROHS3 Compliant