CY91F592BHPMC-GSE2
- Mfr.Part #
- CY91F592BHPMC-GSE2
- Manufacturer
- Infineon Technologies
- Package / Case
- 208-LQFP
- Datasheet
- Download
- Description
- IC MCU 32BIT 576KB FLASH 208LQFP
- Stock
- 21,675
- In Stock :
- 21,675
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Microcontrollers
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Program Memory Size :
- 576KB 576K x 8
- Voltage - Supply (Vcc/Vdd) :
- 2.7V~5.5V
- Oscillator Type :
- External
- Series :
- FR MB91590
- Data Converter :
- A/D 32x8/10b
- RAM Size :
- 848K x 8
- Core Processor :
- FR81S
- Core Size :
- 32-Bit
- Speed :
- 80MHz
- EEPROM Size :
- 64K x 8
- Operating Temperature :
- -40°C~105°C TA
- Package / Case :
- 208-LQFP
- RoHS Status :
- ROHS3 Compliant
- Program Memory Type :
- Flash
- Number of I/O :
- 156
- Peripherals :
- DMA, LVD, POR, PWM, WDT
- Connectivity :
- CANbus, CSIO, EBI/EMI, LINbus, SPI, UART/USART
- Datasheets
- CY91F592BHPMC-GSE2

Microcontrollers Infineon Technologies CY91F592BHPMC-GSE2 Overview
Introducing the CY91F592BHPMC-GSE2 from Infineon Technologies, a high-performance microcontroller tailored for demanding applications that require robust processing capabilities and advanced integration. This microcontroller is part of Infineon's acclaimed line of 32-bit MCUs, designed to offer exceptional performance, enhanced reliability, and increased flexibility. With 576KB of flash memory housed within a 208LQFP package, it meets the rigorous demands of complex digital environments. Ideal for developers focusing on innovation in automotive and industrial applications, the Microcontrollers Infineon Technologies CY91F592BHPMC-GSE2 is engineered to push the boundaries of microcontroller technology.
CY91F592BHPMC-GSE2 Features
This microcontroller boasts a 32-bit architecture that ensures efficient processing and rapid data handling, essential for real-time applications. The 576KB of onboard flash memory facilitates substantial code storage and data logging, essential for firmware updates and application scalability. The inclusion of a 208LQFP package ensures a compact footprint along with excellent thermal stability, making it suitable for densely packed electronic assemblies.
CY91F592BHPMC-GSE2 Applications
- Automotive Control Systems: Utilized in engine management and advanced driver-assistance systems (ADAS), where high reliability and rapid processing are paramount.
- Industrial Automation: Powers complex machinery controls, including robotics and process automation systems, where precision and durability are critical.
- Smart Home Devices: Enhances connectivity and control in home automation products, improving user experience and device interoperability.
- Wearable Technology: Serves in the design of wearable health monitoring devices, offering compact size and power efficiency for continuous operation.
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