CY37256VP256-66BBI

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Mfr.Part #
CY37256VP256-66BBI
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC CPLD 256MC 20NS 256LFBGA
Stock
42,260
In Stock :
42,260

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Manufacturer :
Infineon Technologies
Product Category :
CPLDs (Complex Programmable Logic Devices)
Operating Temperature :
-40°C~85°C TA
Supply Voltage :
3.3V
Lead Free :
Contains Lead
Memory Type :
EEPROM
Radiation Hardening :
No
Length :
17mm
Number of Dedicated Inputs :
1
Number of Macro Cells :
256
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Number of Logic Blocks (LABs) :
16
Output Function :
MACROCELL
Published :
2003
Terminal Pitch :
1mm
Max Supply Voltage :
3.6V
Width :
17mm
JESD-609 Code :
e0
Programmable Type :
In-System Reprogrammable™ (ISR™) CMOS
Terminal Form :
Ball
Terminal Finish :
Tin/Lead (Sn/Pb)
Series :
Ultra37000™
Base Part Number :
CY37256
Package / Case :
256-LBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Min Supply Voltage :
3V
Terminal Position :
BOTTOM
Propagation Delay :
20 ns
Time@Peak Reflow Temperature-Max (s) :
30
Mount :
Surface Mount
Voltage Supply - Internal :
3V~3.6V
Operating Supply Voltage :
3.3V
JTAG BST :
yes
Peak Reflow Temperature (Cel) :
225
Number of Terminations :
256
Frequency :
66MHz
Packaging :
Tray
Turn On Delay Time :
20 ns
Number of I/O :
197
Height Seated (Max) :
1.6mm
Pin Count :
256
HTS Code :
8542.39.00.01
Number of Gates :
7700
Introducing CPLDs (Complex Programmable Logic Devices) Infineon Technologies CY37256VP256-66BBI from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Base Part Number:CY37256, Package / Case:256-LBGA, Number of Terminations:256, CY37256VP256-66BBI pinout, CY37256VP256-66BBI datasheet PDF, CY37256VP256-66BBI amp .Beyond CPLDs (Complex Programmable Logic Devices) Infineon Technologies CY37256VP256-66BBI ,we also offer GAL16V8A-15LVI, PALCE22V10H-15JC/4, PALCE22V10Q-25PC/4, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY37256VP256-66BBI


CPLDs Infineon Technologies CY37256VP256-66BBI Overview

Introducing the Infineon Technologies CY37256VP256-66BBI, a cutting-edge CPLD (Complex Programmable Logic Device) designed for high-performance electronic environments. This device leverages the advanced capabilities of Infineon's technology to offer robust solutions for complex digital systems. With its compact 256LFBGA packaging, it fits perfectly into space-constrained applications while providing a plethora of logic resources and efficient power consumption. Ideal for applications demanding high-speed logic operations, the CY37256VP256-66BBI operates with a quick propagation delay of only 20 ns, ensuring rapid response and process times in critical systems.

CY37256VP256-66BBI Features

The CY37256VP256-66BBI CPLD boasts a suite of features that enhance its utility and performance in a variety of settings. Key features include a 256 macrocell count, providing ample space for logic integration and complex circuit designs. Its high-speed performance is marked by a 20 ns propagation delay, catering to applications requiring rapid data processing and timing precision. Additionally, the 256LFBGA package ensures a minimized footprint on system boards, crucial for modern, compact electronic designs.

CY37256VP256-66BBI Applications

  • Automotive Systems: Utilized in engine control units and automotive infotainment systems, where fast and reliable logic processing is crucial for vehicle safety and functionality.
  • Telecommunications: Employed in network routers and switches to handle complex logic algorithms necessary for data packet routing and signal integrity maintenance.
  • Consumer Electronics: Integrated into smart home devices, offering the necessary logic capabilities for handling multiple user inputs and sensor data integrations efficiently.
  • Industrial Automation: Plays a pivotal role in control systems for manufacturing lines, improving the precision and response times of robotic assembly processes.
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