CC45SL3FD390JYNNA

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Mfr.Part #
CC45SL3FD390JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 39PF 3KV SL RADIAL
Stock
32,865
In Stock :
32,865

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Package / Case :
Radial, Disc
JESD-609 Code :
e3
Width :
6mm
Mount :
Through Hole
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Contact Plating :
Tin
Tolerance :
±5%
Applications :
GENERAL PURPOSE
RoHS Status :
ROHS3 Compliant
Terminal Shape :
Wire
Height Seated (Max) :
0.394 10.00mm
Voltage - Rated :
3000V 3kV
Packaging :
Bulk
Lead/Base Style :
Straight
Mounting Type :
Through Hole
Size / Dimension :
0.236Dia 6.00mm
Pbfree Code :
yes
Lead Style :
Formed Leads - Kinked
Operating Temperature :
-25°C~125°C
Terminal Pitch :
7.5mm
Temperature Coefficient :
SL
Multilayer :
No
HTS Code :
8532.23.00.60
Lead Pitch :
5.0038mm
ECCN Code :
EAR99
Dielectric Material :
Ceramic
Temperature Characteristics Code :
SL
Number of Terminations :
2
Size Code :
2424
Lifecycle Status :
Production (Last Updated: 1 month ago)
Feature :
High Voltage, Low Dissipation Factor
Series :
CC45
Capacitor Type :
CERAMIC CAPACITOR
Published :
2001
Length :
6mm
Capacitance :
39pF
Factory Lead Time :
10 Weeks
Rated (DC) Voltage (URdc) :
3000V
Lead Spacing :
0.295 7.50mm
Datasheets
CC45SL3FD390JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3FD390JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:Radial, Disc, Mounting Type:Through Hole, Operating Temperature:-25°C~125°C, Number of Terminations:2, CC45SL3FD390JYNNA pinout, CC45SL3FD390JYNNA datasheet PDF, CC45SL3FD390JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3FD390JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3FD390JYNNA


CC45 39pF 3000V 3kV Ceramic Capacitor ±5% SL 0.236Dia 6.00mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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