CC45SL3FD220JYNNA

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Mfr.Part #
CC45SL3FD220JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 22PF 3KV SL RADIAL
Stock
1,372
In Stock :
1,372

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Multilayer :
No
Size Code :
2224
Mount :
Through Hole
Dielectric Material :
Ceramic
Tolerance :
±5%
Temperature Coefficient :
SL
Pbfree Code :
yes
Published :
2001
ECCN Code :
EAR99
Terminal Pitch :
7.5mm
RoHS Status :
ROHS3 Compliant
Packaging :
Bulk
Capacitance :
22pF
Feature :
High Voltage, Low Dissipation Factor
Rated (DC) Voltage (URdc) :
3000V
Height Seated (Max) :
0.374 9.50mm
Contact Plating :
Tin
Package / Case :
Radial, Disc
Operating Temperature :
-25°C~125°C
Lead Pitch :
5.0038mm
Number of Terminations :
2
Width :
6mm
Mounting Type :
Through Hole
HTS Code :
8532.23.00.60
Factory Lead Time :
10 Weeks
Capacitor Type :
CERAMIC CAPACITOR
Lifecycle Status :
Production (Last Updated: 1 month ago)
Lead Spacing :
0.295 7.50mm
Lead Style :
Formed Leads - Kinked
Terminal Shape :
Wire
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
JESD-609 Code :
e3
Length :
5.5mm
Series :
CC45
Applications :
GENERAL PURPOSE
Temperature Characteristics Code :
SL
Voltage - Rated :
3000V 3kV
Lead/Base Style :
Straight
Size / Dimension :
0.217Dia 5.50mm
Datasheets
CC45SL3FD220JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3FD220JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:Radial, Disc, Operating Temperature:-25°C~125°C, Number of Terminations:2, Mounting Type:Through Hole, CC45SL3FD220JYNNA pinout, CC45SL3FD220JYNNA datasheet PDF, CC45SL3FD220JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3FD220JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3FD220JYNNA


CC45 22pF 3000V 3kV Ceramic Capacitor ±5% SL 0.217Dia 5.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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