BZV85-C68133

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Terminal Form :

Wire

Mount :

Through Hole

Case Connection :

Isolated

Diode Element Material :

SILICON

Packaging :

Tape and Box (TB)

Power Dissipation :

1.3W

Impedance-Max :

200Ohm

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Current - Reverse Leakage @ Vr :

50nA @ 48V

Peak Reflow Temperature (Cel) :

260

Package / Case :

DO-204AL, DO-41, Axial

ECCN Code :

EAR99

ESD Protection :

No

Voltage Tol-Max :

5%

Mounting Type :

Through Hole

Test Current :

4mA

Pin Count :

2

Published :

2009

Voltage Tolerance :

5%

RoHS Status :

ROHS3 Compliant

Max Reverse Leakage Current :

50nA

Zener Voltage :

68V

Number of Terminations :

2

Element Configuration :

Single

Tolerance :

±5%

Operating Temperature :

-65°C~200°C

JESD-609 Code :

e3

Number of Pins :

2

Max Power Dissipation :

1.3W

Factory Lead Time :

6 Weeks

Diode Type :

ZENER DIODE

Reference Voltage :

68V

HTS Code :

8541.10.00.50

Voltage - Forward (Vf) (Max) @ If :

1V @ 50mA

Contact Plating :

Tin

Time@Peak Reflow Temperature-Max (s) :

30

Number of Elements :

1

Polarity :

Unidirectional

Impedance :

200Ohm

Reference Standard :

IEC-60134