BZB84-B68,215

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

ESD Protection :

No

Element Configuration :

Common Anode

Peak Reflow Temperature (Cel) :

260

Zener Current :

200mA

Diode Type :

ZENER DIODE

Packaging :

Tape and Reel (TR)

Reference Voltage :

68V

Number of Pins :

3

Factory Lead Time :

4 Weeks

Impedance-Max :

240Ohm

Impedance :

240Ohm

Tolerance :

±2%

Forward Voltage :

900mV

Mounting Type :

Surface Mount

Number of Elements :

2

Test Current :

2mA

Zener Voltage :

68V

Max Operating Temperature :

150°C

Package / Case :

TO-236-3, SC-59, SOT-23-3

Number of Terminations :

3

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Min Operating Temperature :

-55°C

Voltage Tol-Max :

2%

Polarity :

Unidirectional

RoHS Status :

ROHS3 Compliant

HTS Code :

8541.10.00.50

Terminal Position :

Dual

Max Power Dissipation :

300mW

Pin Count :

3

Published :

2009

Mount :

Surface Mount

Configuration :

1 Pair Common Anode

JESD-609 Code :

e3

Time@Peak Reflow Temperature-Max (s) :

30

ECCN Code :

EAR99

Terminal Form :

Gull wing

Base Part Number :

BZB84-B68

Contact Plating :

Tin

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Current - Reverse Leakage @ Vr :

50nA @ 47.6V

Max Reverse Leakage Current :

50nA

Diode Element Material :

SILICON

Voltage Tolerance :

2%