BZB84-B39,215

Manufacturer :

NXP Semiconductors

Product Category :

Diodes - Zener - Arrays

Tolerance :

±2%

Mounting Type :

Surface Mount

Polarity :

Unidirectional

Voltage Tol-Max :

2%

Max Power Dissipation :

300mW

ECCN Code :

EAR99

Number of Terminations :

3

Published :

2009

RoHS Status :

ROHS3 Compliant

HTS Code :

8541.10.00.50

Peak Reflow Temperature (Cel) :

260

Diode Element Material :

SILICON

Impedance-Max :

130Ohm

Reference Standard :

AEC-Q101; IEC-60134

Terminal Position :

Dual

ESD Protection :

No

Zener Voltage :

39V

Number of Elements :

2

Test Current :

2mA

Contact Plating :

Tin

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Pin Count :

3

Configuration :

1 Pair Common Anode

Mount :

Surface Mount

Impedance :

130Ohm

Max Reverse Leakage Current :

50nA

Element Configuration :

Common Anode

Package / Case :

TO-236-3, SC-59, SOT-23-3

Terminal Form :

Gull wing

Reference Voltage :

39V

Time@Peak Reflow Temperature-Max (s) :

30

Packaging :

Tape and Reel (TR)

Max Operating Temperature :

150°C

Factory Lead Time :

4 Weeks

JESD-30 Code :

R-PDSO-G3

JESD-609 Code :

e3

Diode Type :

ZENER DIODE

JEDEC-95 Code :

TO-236AB

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Min Operating Temperature :

-55°C

Current - Reverse Leakage @ Vr :

50nA @ 27.3V