BZB84-B24215

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Max Power Dissipation :

300mW

Max Operating Temperature :

150°C

Impedance-Max :

70Ohm

Terminal Form :

Gull wing

Zener Current :

200mA

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Max Reverse Leakage Current :

50nA

Zener Voltage :

24V

Mounting Type :

Surface Mount

Power Dissipation :

300mW

Polarity :

Unidirectional

Impedance :

70Ohm

Number of Pins :

3

Peak Reflow Temperature (Cel) :

260

Mount :

Surface Mount

ECCN Code :

EAR99

Current - Reverse Leakage @ Vr :

50nA @ 16.8V

Pin Count :

3

JESD-609 Code :

e3

Element Configuration :

Common Anode

Diode Element Material :

SILICON

Voltage Tol-Max :

2%

Voltage Tolerance :

2%

HTS Code :

8541.10.00.50

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Test Current :

5mA

Time@Peak Reflow Temperature-Max (s) :

30

RoHS Status :

ROHS3 Compliant

Reference Voltage :

24V

ESD Protection :

No

Packaging :

Tape and Reel (TR)

Number of Elements :

2

Diode Type :

ZENER DIODE

Package / Case :

TO-236-3, SC-59, SOT-23-3

Configuration :

1 Pair Common Anode

Contact Plating :

Tin

Factory Lead Time :

4 Weeks

Terminal Position :

Dual

Tolerance :

±2%

Number of Terminations :

3

Published :

2009