BZB84-B18,215

Manufacturer :

NXP Semiconductors

Product Category :

Diodes - Zener - Arrays

RoHS Status :

ROHS3 Compliant

Element Configuration :

Common Anode

Pin Count :

3

ESD Protection :

No

Polarity :

Unidirectional

Power Dissipation :

300mW

Voltage Tolerance :

2%

Diode Type :

ZENER DIODE

Mounting Type :

Surface Mount

Zener Current :

200mA

Factory Lead Time :

4 Weeks

Tolerance :

±2%

Number of Terminations :

3

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Pins :

3

Impedance :

45Ohm

Contact Plating :

Tin

Configuration :

1 Pair Common Anode

JESD-609 Code :

e3

Packaging :

Tape and Reel (TR)

Impedance-Max :

45Ohm

Max Reverse Leakage Current :

50nA

Terminal Form :

Gull wing

Test Current :

5mA

HTS Code :

8541.10.00.50

Mount :

Surface Mount

Peak Reflow Temperature (Cel) :

260

Terminal Position :

Dual

Time@Peak Reflow Temperature-Max (s) :

30

Current - Reverse Leakage @ Vr :

50nA @ 12.6V

Max Power Dissipation :

300mW

Published :

2009

ECCN Code :

EAR99

Max Operating Temperature :

150°C

Package / Case :

TO-236-3, SC-59, SOT-23-3

Min Operating Temperature :

-55°C

Voltage Tol-Max :

2%

Diode Element Material :

SILICON

Zener Voltage :

18V

Number of Elements :

2

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Reference Voltage :

18V