BZB84-B18,215

Manufacturer :

NXP Semiconductors

Product Category :

Diodes - Zener - Arrays

Diode Element Material :

SILICON

RoHS Status :

ROHS3 Compliant

Mounting Type :

Surface Mount

Current - Reverse Leakage @ Vr :

50nA @ 12.6V

Number of Elements :

2

Max Power Dissipation :

300mW

Pin Count :

3

Terminal Form :

Gull wing

Min Operating Temperature :

-55°C

Factory Lead Time :

4 Weeks

Packaging :

Tape and Reel (TR)

Voltage Tol-Max :

2%

Reference Voltage :

18V

Configuration :

1 Pair Common Anode

Published :

2009

Tolerance :

±2%

Mount :

Surface Mount

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Terminations :

3

ECCN Code :

EAR99

Test Current :

5mA

Time@Peak Reflow Temperature-Max (s) :

30

Voltage Tolerance :

2%

Max Reverse Leakage Current :

50nA

Polarity :

Unidirectional

Diode Type :

ZENER DIODE

Impedance :

45Ohm

Number of Pins :

3

Contact Plating :

Tin

JESD-609 Code :

e3

Package / Case :

TO-236-3, SC-59, SOT-23-3

Max Operating Temperature :

150°C

Peak Reflow Temperature (Cel) :

260

Zener Current :

200mA

ESD Protection :

No

Impedance-Max :

45Ohm

Power Dissipation :

300mW

HTS Code :

8541.10.00.50

Element Configuration :

Common Anode

Zener Voltage :

18V

Terminal Position :

Dual