BUK9624-55A118

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Gate to Source Voltage (Vgs) :

10V

Power Dissipation :

105W

Mounting Type :

Surface Mount

ECCN Code :

EAR99

Packaging :

Tape and Reel (TR)

Radiation Hardening :

No

Transistor Application :

SWITCHING

Vgs (Max) :

±10V

Max Dual Supply Voltage :

55V

Current - Continuous Drain (Id) @ 25°C :

46A Tc

Package / Case :

TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Pin Count :

3

Drain-source On Resistance-Max :

0.026ohm

Terminal Form :

Gull wing

Vgs(th) (Max) @ Id :

2V @ 1mA

Fall Time (Typ) :

80 ns

Drive Voltage (Max Rds On,Min Rds On) :

4.5V 10V

RoHS Status :

ROHS3 Compliant

Factory Lead Time :

12 Weeks

Mount :

Surface Mount

Case Connection :

DRAIN

Element Configuration :

Single

Series :

Automotive, AEC-Q101, TrenchMOS™

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

FET Type :

N-Channel

JESD-30 Code :

R-PSSO-G2

Number of Pins :

3

Continuous Drain Current (ID) :

46A

Number of Elements :

1

Turn On Delay Time :

17.5 ns

Drain to Source Breakdown Voltage :

55V

Input Capacitance (Ciss) (Max) @ Vds :

1815pF @ 25V

Rds On (Max) @ Id, Vgs :

21.7m Ω @ 25A, 10V

Contact Plating :

Tin

Operating Temperature :

-55°C~175°C TJ

Number of Terminations :

2

Power Dissipation-Max :

105W Tc

JESD-609 Code :

e3

Operating Mode :

ENHANCEMENT MODE

Published :

2011

Turn-Off Delay Time :

82.5 ns

Transistor Element Material :

SILICON

Avalanche Energy Rating (Eas) :

76 mJ

Rise Time :

104ns