BUK9275-100A,118

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Operating Temperature :

-55°C~175°C TJ

Turn-Off Delay Time :

58 ns

Packaging :

Tape and Reel (TR)

Fall Time (Typ) :

57 ns

Vgs(th) (Max) @ Id :

2V @ 1mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Rise Time :

120ns

Factory Lead Time :

26 Weeks

Lead Free :

Lead Free

Drain-source On Resistance-Max :

0.084Ohm

Gate to Source Voltage (Vgs) :

10V

Current - Continuous Drain (Id) @ 25°C :

21.7A Tc

Number of Pins :

3

Published :

2010

Vgs (Max) :

±10V

Number of Terminations :

2

FET Type :

N-Channel

Operating Mode :

ENHANCEMENT MODE

Pulsed Drain Current-Max (IDM) :

87A

Max Dual Supply Voltage :

100V

Contact Plating :

Tin

Drain to Source Breakdown Voltage :

100V

Transistor Element Material :

SILICON

Input Capacitance (Ciss) (Max) @ Vds :

1690pF @ 25V

Radiation Hardening :

No

Drive Voltage (Max Rds On,Min Rds On) :

4.5V 10V

Pin Count :

3

Rds On (Max) @ Id, Vgs :

72m Ω @ 10A, 10V

Mounting Type :

Surface Mount

Power Dissipation-Max :

88W Tc

Package / Case :

TO-252-3, DPak (2 Leads + Tab), SC-63

Case Connection :

DRAIN

Terminal Form :

Gull wing

ECCN Code :

EAR99

Transistor Application :

SWITCHING

Number of Elements :

1

Turn On Delay Time :

13 ns

Power Dissipation :

88W

JESD-30 Code :

R-PSSO-G2

Continuous Drain Current (ID) :

21.7A

Element Configuration :

Single

Surface Mount :

yes

JESD-609 Code :

e3

Series :

Automotive, AEC-Q101, TrenchMOS™

RoHS Status :

ROHS3 Compliant