BR93H66RFJ-WCE2

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Mfr.Part #
BR93H66RFJ-WCE2
Manufacturer
ROHM Semiconductor
Package / Case
8-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC EEPROM 4KBIT SPI 8SOPJ
Stock
50
In Stock :
50

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Manufacturer :
ROHM Semiconductor
Product Category :
Memory
Supply Voltage :
4V
Memory Type :
Non-Volatile
Memory Format :
EEPROM
Operating Mode :
SYNCHRONOUS
Published :
2013
JESD-30 Code :
R-PDSO-G8
Number of Functions :
1
Memory Density :
4096 bit
Number of Terminations :
8
Supply Voltage-Max (Vsup) :
5.5V
Height Seated (Max) :
1.65mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Clock Frequency :
1.25MHz
Length :
4.9mm
Endurance :
1000000 Write/Erase Cycles
Operating Temperature :
-40°C~125°C TA
Qualification Status :
Not Qualified
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Width :
3.9mm
Write Cycle Time - Word, Page :
5ms
Terminal Pitch :
1.27mm
Write Protection :
SOFTWARE
Memory Width :
16
Supply Voltage-Min (Vsup) :
2.7V
Supply Current-Max :
0.0015mA
Factory Lead Time :
12 Weeks
Organization :
256X16
Packaging :
Cut Tape (CT)
Parallel/Serial :
Serial
Mounting Type :
Surface Mount
Write Cycle Time-Max (tWC) :
10ms
Terminal Position :
Dual
Package / Case :
8-SOIC (0.154, 3.90mm Width)
Serial Bus Type :
3-WIRE
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Voltage - Supply :
2.7V~5.5V
Memory Interface :
SPI
Standby Current-Max :
0.000002A
Memory Size :
4Kb 256 x 16
RoHS Status :
ROHS3 Compliant
Additional Feature :
SEATED HT-CALCULATED
Series :
Automotive, AEC-Q100
Data Retention Time-Min :
40
Power Supplies :
2/5V
Datasheets
BR93H66RFJ-WCE2
Introducing Memory ROHM Semiconductor BR93H66RFJ-WCE2 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:8, Operating Temperature:-40°C~125°C TA, Mounting Type:Surface Mount, Package / Case:8-SOIC (0.154, 3.90mm Width), BR93H66RFJ-WCE2 pinout, BR93H66RFJ-WCE2 datasheet PDF, BR93H66RFJ-WCE2 amp .Beyond Memory ROHM Semiconductor BR93H66RFJ-WCE2 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BR93H66RFJ-WCE2


Memory ROHM Semiconductor BR93H66RFJ-WCE2 Overview

ROHM Semiconductor presents the BR93H66RFJ-WCE2, an Integrated Circuit (IC) EEPROM with a capacity of 4KBIT utilizing the Serial Peripheral Interface (SPI). This 8-pin Small Outline Plastic J-leaded Package (SOPJ) device offers a compact and efficient solution for storing critical data in various electronic systems. With its robust design and reliable performance, this EEPROM is tailored to meet the demanding requirements of modern industrial applications.

BR93H66RFJ-WCE2 Features

  • 4KBIT EEPROM capacity
  • SPI (Serial Peripheral Interface) for seamless integration
  • 8-pin SOPJ package for space-efficient design
  • Robust construction ensuring reliability in industrial environments
  • Low power consumption for energy-efficient operation
  • Wide operating voltage range for versatile compatibility
  • High-speed data transfer for efficient performance

BR93H66RFJ-WCE2 Applications

  • Industrial Automation: The BR93H66RFJ-WCE2 EEPROM finds application in industrial automation systems for storing configuration parameters, calibration data, and operating parameters. Its robust design and wide operating voltage range make it suitable for use in harsh industrial environments, ensuring reliable performance in critical applications.
  • Consumer Electronics: In consumer electronics devices such as set-top boxes and smart meters, the BR93H66RFJ-WCE2 provides non-volatile storage for firmware, user settings, and configuration data. Its compact SOPJ package enables space-efficient integration into small form factor devices, while its low power consumption contributes to extended battery life.
  • Automotive Electronics: Within automotive electronics, the BR93H66RFJ-WCE2 serves as a vital component for storing vehicle settings, event logs, and diagnostic information. Its high-speed data transfer capability ensures rapid access to critical data, while its robust construction withstands the challenging operating conditions within automotive systems.
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