BAS56,215

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Surface Mount :

yes

Diode Type :

Standard

Diode Element Material :

SILICON

Terminal Form :

Gull wing

RoHS Status :

ROHS3 Compliant

Terminal Finish :

Tin (Sn)

Base Part Number :

BAS56

Packaging :

Tape and Reel (TR)

Power Dissipation-Max :

0.25W

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Speed :

Small Signal =< 200mA (Io), Any Speed

Peak Reflow Temperature (Cel) :

260

Current - Average Rectified (Io) :

200mA DC

Case Connection :

CATHODE

Number of Elements :

2

ECCN Code :

EAR99

Package / Case :

TO-253-4, TO-253AA

Factory Lead Time :

4 Weeks

Current - Reverse Leakage @ Vr :

100nA @ 120V

JESD-609 Code :

e3

Terminal Position :

Dual

Mounting Type :

Surface Mount

Reverse Current-Max :

0.1μA

Forward Current :

200mA

Number of Pins :

4

Number of Terminations :

4

Voltage - Forward (Vf) (Max) @ If :

1V @ 200mA

Operating Temperature - Junction :

150°C Max

Qualification Status :

Not Qualified

Rep Pk Reverse Voltage-Max :

60V

Output Current-Max :

0.2A

Reverse Recovery Time :

6ns

Pin Count :

4

Time@Peak Reflow Temperature-Max (s) :

40

Voltage - DC Reverse (Vr) (Max) :

60V

Operating Temperature (Max) :

150°C

Diode Configuration :

2 Independent