ATSAM3S2AA-MU

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Mfr.Part #
ATSAM3S2AA-MU
Manufacturer
Microchip Technology
Package / Case
48-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 128KB FLASH 48QFN
Stock
1,111
In Stock :
1,111

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
JESD-609 Code :
e3
Product Category :
ARM Microcontrollers - MCU
Device Core :
ARM Cortex M3
Product Type :
ARM Microcontrollers - MCU
Maximum Operating Temperature :
+ 85 C
ROM (words) :
131072
Lead Free :
Lead Free
Data Converter :
A/D 8x10/12b
Number of Timers/Counters :
3
Number of I/O Lines :
34
Surface Mount :
yes
Program Memory Size :
128KB 128K x 8
PWM Channels :
yes
RoHS Status :
ROHS3 Compliant
Number of Terminals :
48
Manufacturer :
Microchip
CPU Family :
CORTEX-M3
REACH SVHC :
No SVHC
ROM Programmability :
Flash
Bit Size :
32
Core Size :
32-Bit
Operating Temperature :
-40°C~85°C TA
Memory Size :
128kB
Qualification Status :
Not Qualified
Temperature Grade :
Industrial
Number of Terminations :
48
Packaging :
Tray
RoHS :
Details
Supply Voltage-Max (Vsup) :
1.95V
Package :
Tray
Height Seated (Max) :
0.9mm
Has ADC :
yes
Minimum Operating Temperature :
- 40 C
Length :
7mm
Factory Lead Time :
19 Weeks
Number of ADC Channels :
8 Channel
Supply Voltage-Min (Vsup) :
1.62V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Mount :
Surface Mount
Terminal Form :
NO LEAD
Peripherals :
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Mounting Type :
Surface Mount
Package / Case :
48-VFQFN Exposed Pad
Seated Height-Max :
0.9 mm
JESD-30 Code :
S-XQCC-N48
Series :
SAM3S
Frequency :
64MHz
Interface :
2-Wire, I2C, I2S, MMC, SPI, UART, USART, USB
Brand :
Microchip Technology
Data Converters :
A/D 8x10/12b
Program Memory Type :
Flash
RAM (bytes) :
32768
Connectivity :
I2C, MMC, SPI, SSC, UART/USART, USB
Contact Plating :
Tin
Number of Pins :
48
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
yes
Data Bus Width :
32b
Number of I/O :
34
Reach Compliance Code :
Compliant
Watchdog Timer :
yes
Core Processor :
ARM® Cortex®-M3
Package Shape :
Square
Number of I/Os :
34 I/O
Published :
1997
Terminal Finish :
Matte Tin (Sn)
Product Status :
Active
Supplier Device Package :
48-QFN (7x7)
Base Part Number :
ATSAM3S2
RAM Size :
32K x 8
Base Product Number :
ATSAM3S
Interfaces :
I2C/I2S/SPI/UART/USA
Width :
7 mm
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Core Architecture :
ARM
Voltage - Supply (Vcc/Vdd) :
1.62V~3.6V
Terminal Pitch :
0.5mm
EEPROM Size :
--
Speed :
64MHz
DMA Channels :
yes
DAC Channels :
No
Mounting Style :
SMD/SMT
Interface Type :
2-Wire, RS-485, SPI, UART
Oscillator Type :
Internal
Supply Voltage :
1.8V
Power Supplies :
1.8,3.3 V
Terminal Position :
QUAD
Datasheets
ATSAM3S2AA-MU
Introducing Microcontrollers Microchip Technology ATSAM3S2AA-MU from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Terminations:48, Mounting Type:Surface Mount, Package / Case:48-VFQFN Exposed Pad, Number of Pins:48, Base Part Number:ATSAM3S2, ATSAM3S2AA-MU pinout, ATSAM3S2AA-MU datasheet PDF, ATSAM3S2AA-MU amp .Beyond Microcontrollers Microchip Technology ATSAM3S2AA-MU ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology ATSAM3S2AA-MU


Microcontrollers + Microchip Technology ATSAM3S2AA-MU Overview

Microchip Technology的ATSAM3S2AA-MU是一款功能强大的32位微控制器,内含128KB闪存和48引脚的QFN封装。这款器件基于ARM Cortex-M3架构,提供卓越的性能和灵活性,非常适合需要高效处理和低功耗的应用。凭借其丰富的外设和模块化设计,它在嵌入式系统中具有广泛的适用性。此器件适用于各种商业和工业应用,包括医疗设备、工业自动化和物联网设备。Microcontrollers + Microchip Technology ATSAM3S2AA-MU满足了对可靠性和耐久性的高要求,是许多设计和开发项目的理想选择。

ATSAM3S2AA-MU Features

ATSAM3S2AA-MU提供了一系列强大的功能,包括: - ARM Cortex-M3处理器,提供高效的计算性能。 - 128KB闪存,适合复杂的软件和数据存储需求。 - 丰富的外设接口,包括UART、SPI、I2C等,便于多样化的连接。 - 48QFN封装,尺寸紧凑,适用于小型和空间受限的设计。 - 低功耗特性,适合电池供电的应用场景。

ATSAM3S2AA-MU Applications

以下是ATSAM3S2AA-MU的主要应用领域: - 工业自动化:可用于控制器和传感器,提供稳定和可靠的性能。 - 医疗设备:凭借其低功耗特性和丰富的接口,适合用于便携式医疗设备。 - 物联网设备:其多样的连接选项和高效的处理能力,使其成为物联网应用的理想选择。 - 消费类电子产品:适合用于需要高性能和低功耗的电子设备,如智能家居设备和穿戴式设备。
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