AS4C8M32S-6BIN

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Mfr.Part #
AS4C8M32S-6BIN
Manufacturer
Alliance Memory, Inc.
Package / Case
90-TFBGA
Datasheet
Download
Description
IC DRAM 256MBIT PARALLEL 90TFBGA
Stock
3,147
In Stock :
3,147

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Interleaved Burst Length :
1248
Memory Width :
32
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Supply Voltage-Min (Vsup) :
3V
Number of Pins :
90
Memory Format :
DRAM
Address Bus Width :
12b
Write Cycle Time - Word, Page :
2ns
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.32.00.24
Organization :
8MX32
Length :
13mm
Output Characteristics :
3-STATE
Memory Type :
Volatile
Height Seated (Max) :
1.4mm
Clock Frequency :
166MHz
Memory Size :
256Mb 8M x 32
Refresh Cycles :
4096
Terminal Pitch :
0.8mm
ECCN Code :
EAR99
I/O Type :
COMMON
Packaging :
Tray
Published :
2013
Access Time :
5ns
Lead Free :
Lead Free
Number of Terminations :
90
Package / Case :
90-TFBGA
Radiation Hardening :
No
Operating Temperature :
-40°C~85°C TA
Density :
256 Mb
Standby Current-Max :
0.012A
Data Bus Width :
32b
Operating Supply Voltage :
3.3V
Supply Voltage-Max (Vsup) :
3.6V
Supply Voltage :
3.3V
Sequential Burst Length :
1248FP
Supply Current-Max :
0.28mA
Number of Functions :
1
Additional Feature :
AUTO/SELF REFRESH
Voltage - Supply :
3V~3.6V
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Number of Ports :
1
Datasheets
AS4C8M32S-6BIN
Introducing Memory Alliance Memory, Inc. AS4C8M32S-6BIN from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:90, Number of Terminations:90, Package / Case:90-TFBGA, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, AS4C8M32S-6BIN pinout, AS4C8M32S-6BIN datasheet PDF, AS4C8M32S-6BIN amp .Beyond Memory Alliance Memory, Inc. AS4C8M32S-6BIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C8M32S-6BIN


Memory Alliance Memory, Inc. AS4C8M32S-6BIN Overview

The Memory Alliance Memory, Inc. AS4C8M32S-6BIN is a high-capacity, dynamic random-access memory (DRAM) module designed to meet the demands of sophisticated electronics that require optimal speed and reliability. With a dense configuration of 256Mbit and utilizing a parallel interface, this product is encapsulated in a compact 90TFBGA package, ensuring efficient thermal management and space-saving attributes suitable for high-performance applications. This DRAM IC is ideal for businesses looking to enhance their systems with a memory solution that offers a blend of performance, durability, and cost-effectiveness.

AS4C8M32S-6BIN Features

  • High Density: Offers a substantial memory capacity of 256Mbit, ideal for processing large amounts of data efficiently.
  • 90TFBGA Package: Compact package design that provides superior thermal characteristics and minimizes PCB space usage.
  • Parallel Interface: Ensures fast data transfer rates that are essential for high-speed computing needs.
  • Low Power Consumption: Designed to operate with reduced power requirements, enhancing overall system energy efficiency.

AS4C8M32S-6BIN Applications

  • Consumer Electronics: Utilized in devices like digital cameras and gaming consoles, where high-speed memory is crucial for user experience.
  • Telecommunication Equipment: Critical for handling complex processes in networking hardware, ensuring reliable data flow and storage.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) for faster processing of sensor data, enhancing safety and performance.
  • Industrial Automation: Supports robust control systems that require rapid access to data to maintain operational efficiency and machine responsiveness.
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Shipping Cost

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