AS4C8M32S-6BIN
- Mfr.Part #
- AS4C8M32S-6BIN
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 90-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 256MBIT PARALLEL 90TFBGA
- Stock
- 3,147
- In Stock :
- 3,147
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Interleaved Burst Length :
- 1248
- Memory Width :
- 32
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 3V
- Number of Pins :
- 90
- Memory Format :
- DRAM
- Address Bus Width :
- 12b
- Write Cycle Time - Word, Page :
- 2ns
- RoHS Status :
- ROHS3 Compliant
- HTS Code :
- 8542.32.00.24
- Organization :
- 8MX32
- Length :
- 13mm
- Output Characteristics :
- 3-STATE
- Memory Type :
- Volatile
- Height Seated (Max) :
- 1.4mm
- Clock Frequency :
- 166MHz
- Memory Size :
- 256Mb 8M x 32
- Refresh Cycles :
- 4096
- Terminal Pitch :
- 0.8mm
- ECCN Code :
- EAR99
- I/O Type :
- COMMON
- Packaging :
- Tray
- Published :
- 2013
- Access Time :
- 5ns
- Lead Free :
- Lead Free
- Number of Terminations :
- 90
- Package / Case :
- 90-TFBGA
- Radiation Hardening :
- No
- Operating Temperature :
- -40°C~85°C TA
- Density :
- 256 Mb
- Standby Current-Max :
- 0.012A
- Data Bus Width :
- 32b
- Operating Supply Voltage :
- 3.3V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Supply Voltage :
- 3.3V
- Sequential Burst Length :
- 1248FP
- Supply Current-Max :
- 0.28mA
- Number of Functions :
- 1
- Additional Feature :
- AUTO/SELF REFRESH
- Voltage - Supply :
- 3V~3.6V
- Memory Interface :
- Parallel
- Mounting Type :
- Surface Mount
- Number of Ports :
- 1
- Datasheets
- AS4C8M32S-6BIN

Memory Alliance Memory, Inc. AS4C8M32S-6BIN Overview
The Memory Alliance Memory, Inc. AS4C8M32S-6BIN is a high-capacity, dynamic random-access memory (DRAM) module designed to meet the demands of sophisticated electronics that require optimal speed and reliability. With a dense configuration of 256Mbit and utilizing a parallel interface, this product is encapsulated in a compact 90TFBGA package, ensuring efficient thermal management and space-saving attributes suitable for high-performance applications. This DRAM IC is ideal for businesses looking to enhance their systems with a memory solution that offers a blend of performance, durability, and cost-effectiveness.
AS4C8M32S-6BIN Features
- High Density: Offers a substantial memory capacity of 256Mbit, ideal for processing large amounts of data efficiently.
- 90TFBGA Package: Compact package design that provides superior thermal characteristics and minimizes PCB space usage.
- Parallel Interface: Ensures fast data transfer rates that are essential for high-speed computing needs.
- Low Power Consumption: Designed to operate with reduced power requirements, enhancing overall system energy efficiency.
AS4C8M32S-6BIN Applications
- Consumer Electronics: Utilized in devices like digital cameras and gaming consoles, where high-speed memory is crucial for user experience.
- Telecommunication Equipment: Critical for handling complex processes in networking hardware, ensuring reliable data flow and storage.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) for faster processing of sensor data, enhancing safety and performance.
- Industrial Automation: Supports robust control systems that require rapid access to data to maintain operational efficiency and machine responsiveness.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















