AS4C8M16S-6BIN
- Mfr.Part #
- AS4C8M16S-6BIN
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 54-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 128MBIT PARALLEL 54TFBGA
- Stock
- 45,806
- In Stock :
- 45,806
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Max Supply Current :
- 120mA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Length :
- 8mm
- Supply Voltage-Max (Vsup) :
- 3.6V
- Terminal Pitch :
- 0.8mm
- ECCN Code :
- EAR99
- Operating Mode :
- SYNCHRONOUS
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Data Bus Width :
- 16b
- Lead Free :
- Lead Free
- Operating Temperature :
- -40°C~85°C TA
- Density :
- 128 Mb
- Memory Type :
- Volatile
- Published :
- 2014
- Packaging :
- Tray
- Voltage - Supply :
- 3V~3.6V
- Clock Frequency :
- 166MHz
- RoHS Status :
- RoHS Compliant
- Organization :
- 8MX16
- Memory Format :
- DRAM
- Access Time :
- 5ns
- Address Bus Width :
- 12b
- Supply Voltage-Min (Vsup) :
- 3V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage :
- 3.3V
- Number of Terminations :
- 54
- Memory Width :
- 16
- Number of Pins :
- 54
- Package / Case :
- 54-TFBGA
- Number of Functions :
- 1
- Height Seated (Max) :
- 1.2mm
- Operating Supply Voltage :
- 3.3V
- Number of Ports :
- 1
- Additional Feature :
- AUTO/SELF REFRESH
- Memory Interface :
- Parallel
- Surface Mount :
- yes
- Terminal Position :
- BOTTOM
- Write Cycle Time - Word, Page :
- 2ns
- Memory Size :
- 128Mb 8M x 16
- Datasheets
- AS4C8M16S-6BIN

Memory Alliance Memory, Inc. AS4C8M16S-6BIN Overview
The Memory Alliance Memory, Inc. AS4C8M16S-6BIN is a high-performance 128Mbit DRAM chip, engineered using the latest in memory technology. Designed for applications demanding high memory bandwidth and low power consumption, this IC is packaged in a compact 54TFBGA that ensures a minimal footprint on system boards. With its robust design and reliable performance, the AS4C8M16S-6BIN is ideal for advanced computing and industrial applications, supporting a wide range of operating temperatures and offering exceptional durability and stability.
AS4C8M16S-6BIN Features
This DRAM IC features a parallel interface, providing rapid data transfer rates that are essential for high-speed computing tasks. Its 128Mbit capacity is suited for complex processes in embedded systems. The 54TFBGA package is not only space-efficient but also enhances the thermal characteristics, allowing the device to operate under various environmental conditions without compromising on performance.
AS4C8M16S-6BIN Applications
- Consumer Electronics: Utilized in devices like digital cameras and audio players, where consistent and rapid access to large volumes of data is necessary for user satisfaction and device functionality.
- Automotive Systems: Employs in navigation and infotainment systems, providing the required speed and capacity for real-time processing and data storage.
- Telecommunication Infrastructure: Supports communications equipment such as routers and switches, ensuring efficient handling of multiple data streams and enhancing network reliability.
- Industrial Automation: Integral to automation controllers and industrial PCs, where stability and long-term reliability are critical for continuous operation and monitoring.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
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