AS4C64M8D3L-12BIN

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Mfr.Part #
AS4C64M8D3L-12BIN
Manufacturer
Alliance Memory, Inc.
Package / Case
78-VFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 78FBGA
Stock
23,921
In Stock :
23,921

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Mode :
SYNCHRONOUS
Length :
10.5mm
Memory Format :
DRAM
Memory Interface :
Parallel
Height Seated (Max) :
1mm
Clock Frequency :
800MHz
Memory Width :
8
Width :
8mm
Organization :
64MX8
Additional Feature :
AUTO/SELF REFRESH
Operating Temperature :
-40°C~95°C TA
Factory Lead Time :
8 Weeks
Supply Voltage-Max (Vsup) :
1.45V
Memory Size :
512Mb 64M x 8
Number of Terminations :
78
Memory Density :
536870912 bit
Access Time :
20ns
JESD-30 Code :
R-PBGA-B78
Number of Ports :
1
Published :
2017
Package / Case :
78-VFBGA
Surface Mount :
yes
Voltage - Supply :
1.283V~1.45V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Terminal Pitch :
0.8mm
RoHS Status :
ROHS3 Compliant
Supply Voltage :
1.35V
Number of Functions :
1
Supply Voltage-Min (Vsup) :
1.283V
Memory Type :
Volatile
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Position :
BOTTOM
Packaging :
Tray
Datasheets
AS4C64M8D3L-12BIN
Introducing Memory Alliance Memory, Inc. AS4C64M8D3L-12BIN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~95°C TA, Number of Terminations:78, Package / Case:78-VFBGA, AS4C64M8D3L-12BIN pinout, AS4C64M8D3L-12BIN datasheet PDF, AS4C64M8D3L-12BIN amp .Beyond Memory Alliance Memory, Inc. AS4C64M8D3L-12BIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C64M8D3L-12BIN


Memory Alliance Memory, Inc. AS4C64M8D3L-12BIN Overview

The AS4C64M8D3L-12BIN by Alliance Memory, Inc. represents a cutting-edge solution in the world of electronic memory storage, specifically tailored for high-performance applications requiring robust, large-scale data handling. This 512Mbit DRAM integrated circuit is designed with precision to support sustained data rates and reliability under a variety of operational conditions. Engineered in a compact 78FBGA package, it provides an optimal balance between physical footprint and performance, ensuring seamless integration into existing technology frameworks. This product's capability to handle parallel processing makes it an ideal choice for manufacturers and developers looking to enhance the efficiency and performance of their advanced systems.

AS4C64M8D3L-12BIN Features

The AS4C64M8D3L-12BIN boasts numerous features that make it a versatile and essential component in modern electronics. Its 512Mbit storage capacity is crucial for systems requiring large memory bandwidth. The parallel interface facilitates faster data transfer rates, enhancing overall system responsiveness. Additionally, the compact 78FBGA packaging not only saves space but also allows for more efficient thermal management within dense circuit designs.

AS4C64M8D3L-12BIN Applications

  • Consumer Electronics: Utilized in devices such as smartphones, tablets, and gaming consoles, this DRAM module ensures smooth multitasking and high-speed data processing.
  • Computing Systems: Integral to both personal computers and servers, it provides the necessary bandwidth for data-intensive applications and enhances system performance.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) and infotainment systems, offering reliable performance under varying environmental conditions.
  • Industrial Automation: Employs in control systems that require rapid processing of large volumes of data for real-time automation and monitoring.
  • Networking: Key component in routers and switches, facilitating high-speed data transfer and improving bandwidth capacity across network infrastructures.
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Shipping Cost

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