AS4C64M8D1-5BIN
- Mfr.Part #
- AS4C64M8D1-5BIN
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 60-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 512MBIT PARALLEL 60FBGA
- Stock
- 189
- In Stock :
- 189
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Operating Temperature :
- -40°C~85°C TA
- Access Time :
- 700ps
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 2.3V~2.7V
- Memory Width :
- 8
- Packaging :
- Tray
- Height Seated (Max) :
- 1.2mm
- Number of Functions :
- 1
- Terminal Pitch :
- 1mm
- Memory Size :
- 512Mb 64M x 8
- ECCN Code :
- EAR99
- Published :
- 2015
- Width :
- 8mm
- Write Cycle Time - Word, Page :
- 15ns
- Organization :
- 64MX8
- Clock Frequency :
- 200MHz
- Memory Density :
- 536870912 bit
- Memory Type :
- Volatile
- Number of Ports :
- 1
- Supply Voltage-Min (Vsup) :
- 2.3V
- Factory Lead Time :
- 8 Weeks
- Length :
- 13mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 60-TFBGA
- Additional Feature :
- AUTO/SELF REFRESH
- Memory Interface :
- Parallel
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 2.5V
- Surface Mount :
- yes
- Number of Terminations :
- 60
- Memory Format :
- DRAM
- JESD-30 Code :
- R-PBGA-B60
- Operating Mode :
- SYNCHRONOUS
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 2.7V
- Terminal Position :
- BOTTOM
- Datasheets
- AS4C64M8D1-5BIN

Memory Alliance Memory, Inc. AS4C64M8D1-5BIN Overview
Introducing the AS4C64M8D1-5BIN from Alliance Memory, Inc., a pioneering solution in the realm of integrated circuits. This IC DRAM, boasting a capacity of 512MBIT, comes in a parallel 60FBGA package, ensuring optimal performance and seamless integration into diverse electronic systems. Crafted with precision and reliability in mind, this component stands as a testament to Alliance Memory's commitment to innovation and excellence.
AS4C64M8D1-5BIN Features
- High Capacity: With 512MBIT of memory, this IC DRAM provides ample storage for demanding applications.
- Parallel Architecture: The parallel 60FBGA configuration enables efficient data transfer and processing.
- Robust Design: Built to withstand rigorous conditions, ensuring durability and longevity.
- Low Power Consumption: Optimized for energy efficiency, minimizing operational costs.
- Wide Compatibility: Compatible with a variety of electronic devices and systems, enhancing versatility.
AS4C64M8D1-5BIN Applications
- Industrial Automation: Implement the AS4C64M8D1-5BIN in industrial control systems to enhance data processing and storage capabilities, ensuring smooth and efficient operation in manufacturing environments.
- Networking Equipment: Integrate this component into routers, switches, and other networking devices to bolster memory capacity, facilitating faster data transmission and efficient network management.
- Telecommunications: Utilize the AS4C64M8D1-5BIN in telecommunications infrastructure to support high-speed data processing, enabling reliable communication services in both wired and wireless networks.
- Medical Devices: Incorporate this IC DRAM into medical equipment such as imaging devices and patient monitoring systems to store and process critical patient data with precision and accuracy.
- Automotive Electronics: Enhance the performance of automotive electronics systems, including infotainment systems and advanced driver assistance systems (ADAS), by leveraging the high capacity and robust design of the AS4C64M8D1-5BIN.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
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