AS4C64M32MD2-25BCNTR

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Mfr.Part #
AS4C64M32MD2-25BCNTR
Manufacturer
Alliance Memory, Inc.
Package / Case
134-VFBGA
Datasheet
Download
Description
IC DRAM 2GBIT PARALLEL 134FBGA
Stock
24,310
In Stock :
24,310

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Memory Format :
DRAM
Mounting Type :
Surface Mount
Memory Size :
2Gb 64M x 32
Package / Case :
134-VFBGA
Memory Type :
Volatile
Voltage - Supply :
1.14V~1.95V
Packaging :
Tape and Reel (TR)
Factory Lead Time :
8 Weeks
Operating Temperature :
-30°C~85°C TA
Clock Frequency :
400MHz
Memory Interface :
Parallel
Write Cycle Time - Word, Page :
15ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing Memory Alliance Memory, Inc. AS4C64M32MD2-25BCNTR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:134-VFBGA, Operating Temperature:-30°C~85°C TA, AS4C64M32MD2-25BCNTR pinout, AS4C64M32MD2-25BCNTR datasheet PDF, AS4C64M32MD2-25BCNTR amp .Beyond Memory Alliance Memory, Inc. AS4C64M32MD2-25BCNTR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C64M32MD2-25BCNTR


Memory Alliance Memory, Inc. AS4C64M32MD2-25BCNTR Overview

The Memory Alliance Memory, Inc. AS4C64M32MD2-25BCNTR is a high-capacity 2Gbit DRAM chip designed for applications demanding substantial data throughput and storage. Engineered using advanced technology by Alliance Memory, Inc., this DRAM ensures optimal reliability and speed with a 134FBGA packaging that facilitates efficient thermal management and compact mounting solutions. This product is ideal for businesses looking to enhance their systems' memory capacity with a dependable and robust memory module that seamlessly integrates into various electronic configurations.

AS4C64M32MD2-25BCNTR Features

The AS4C64M32MD2-25BCNTR features a parallel interface, offering quick data transfer rates which are essential for high-speed computing environments. With its substantial 2Gbit storage capacity, this memory module supports extensive data handling requirements. The 134-ball fine-pitch ball grid array (FBGA) package not only reduces the physical space required on printed circuit boards but also enhances signal integrity and mechanical performance under a variety of environmental conditions.

AS4C64M32MD2-25BCNTR Applications

  • Advanced Computing Systems: Utilizes large capacity and fast data transfer speeds to handle complex calculations and processes, enhancing overall system performance.
  • Consumer Electronics: Integrates into devices such as high-performance gaming consoles and smart TVs, providing the necessary bandwidth and storage to support enhanced graphics and user interfaces.
  • Telecommunications Equipment: Supports the high-speed memory requirements needed for routing and switching platforms, ensuring efficient data flow and system reliability.
  • Industrial Automation: Applied in machine control systems where large memory capacity and data integrity are crucial for stable and continuous operations.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process and store vast amounts of data in real-time, crucial for system responsiveness and safety enhancements.
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Shipping Cost

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