AS4C64M16D3LA-12BIN
- Mfr.Part #
- AS4C64M16D3LA-12BIN
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 96-VFBGA
- Datasheet
- Download
- Description
- IC DRAM 1GBIT PARALLEL 96FBGA
- Stock
- 11,528
- In Stock :
- 11,528
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Pbfree Code :
- yes
- Number of Ports :
- 1
- Operating Mode :
- SYNCHRONOUS
- Factory Lead Time :
- 8 Weeks
- Clock Frequency :
- 800MHz
- Memory Format :
- DRAM
- Voltage - Supply :
- 1.283V~1.45V
- Terminal Pitch :
- 0.8mm
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1.35V
- Height Seated (Max) :
- 1mm
- Memory Size :
- 1Gb 64M x 16
- Memory Density :
- 1073741824 bit
- Access Time :
- 20ns
- Published :
- 2015
- JESD-30 Code :
- R-PBGA-B96
- RoHS Status :
- ROHS3 Compliant
- Width :
- 8mm
- Additional Feature :
- AUTO/SELF REFRESH
- Package / Case :
- 96-VFBGA
- Organization :
- 64MX16
- Surface Mount :
- yes
- Number of Terminations :
- 96
- Length :
- 13mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage-Max (Vsup) :
- 1.45V
- Supply Voltage-Min (Vsup) :
- 1.283V
- Packaging :
- Tray
- Write Cycle Time - Word, Page :
- 15ns
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Memory Width :
- 16
- Operating Temperature :
- -40°C~95°C TC
- Number of Functions :
- 1
- Memory Type :
- Volatile
- Memory Interface :
- Parallel
- Mounting Type :
- Surface Mount
- Datasheets
- AS4C64M16D3LA-12BIN

Memory Alliance Memory, Inc. AS4C64M16D3LA-12BIN Overview
The Memory Alliance Memory, Inc. AS4C64M16D3LA-12BIN DRAM offers an exceptional 1 Gbit density, engineered to meet the high standards of both performance and reliability. This integrated circuit features a 96FBGA package, optimizing both thermal management and space utilization in a wide range of applications. Designed with scalability in mind, it facilitates significant enhancements in system operations by increasing memory bandwidth and storage capacity, which is crucial for advanced computing systems. Its robust architecture makes it ideal for high-performance applications that require durable, continuous, and reliable memory solutions.
AS4C64M16D3LA-12BIN Features
This DRAM module is designed with a parallel interface, offering high-speed data transfer rates that are essential for real-time computing applications. The 96FBGA package not only ensures compactness but also enhances the thermal characteristics of the device, making it suitable for tightly packed system environments. The AS4C64M16D3LA-12BIN operates at a standard 1.2V, which allows for lower power consumption while maintaining high throughput and reliability.
AS4C64M16D3LA-12BIN Applications
- Computing: Used in desktops, laptops, and servers where high capacity memory is crucial for multitasking and data-intensive applications.
- Consumer Electronics: Integrated into devices such as smart TVs and gaming consoles, enhancing user experience through improved responsiveness and higher resolution graphics processing capabilities.
- Networking: Deployed in routers and switches, facilitating faster data buffering and efficient handling of high-speed network traffic.
- Industrial: Applied in automation systems and industrial PCs which require robust memory solutions to handle complex tasks and operate reliably in harsh environments.
- Telecommunications: Essential for telecom equipment like base stations that require large amounts of memory for processing vast quantities of data and supporting multiple network interfaces and services.
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