AS4C512M16D3L-12BIN

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Mfr.Part #
AS4C512M16D3L-12BIN
Manufacturer
Alliance Memory, Inc.
Package / Case
96-TFBGA
Datasheet
Download
Description
IC DRAM 8GBIT PARALLEL 96FBGA
Stock
3,112
In Stock :
3,112

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Operating Temperature :
-40°C~95°C TC
Memory Interface :
Parallel
RoHS Status :
ROHS3 Compliant
Supply Voltage-Min (Vsup) :
1.283V
Organization :
512MX16
Memory Type :
Volatile
Memory Density :
8589934592 bit
Mounting Type :
Surface Mount
Memory Width :
16
Memory Format :
DRAM
Height :
1.2mm
Power Supplies :
1.35V
Supply Voltage-Max (Vsup) :
1.45V
Refresh Cycles :
8192
Terminal Position :
BOTTOM
Additional Feature :
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
Operating Mode :
SYNCHRONOUS
JESD-30 Code :
R-PBGA-B96
Length :
14mm
Number of Functions :
1
Voltage - Supply :
1.283V~1.45V
Sequential Burst Length :
8
Factory Lead Time :
8 Weeks
Supply Current-Max :
0.22mA
Clock Frequency :
800MHz
I/O Type :
COMMON
Write Cycle Time - Word, Page :
15ns
Width :
9mm
Packaging :
Tray
Output Characteristics :
3-STATE
Published :
2015
Terminal Pitch :
0.8mm
Number of Terminations :
96
Memory Size :
8Gb 512M x 16
Surface Mount :
yes
Package / Case :
96-TFBGA
Qualification Status :
Not Qualified
Number of Ports :
1
Lead Free :
Lead Free
Standby Current-Max :
0.011A
Access Time :
13.75ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
EAR99
Interleaved Burst Length :
8
Supply Voltage :
1.35V
Introducing Memory Alliance Memory, Inc. AS4C512M16D3L-12BIN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~95°C TC, Mounting Type:Surface Mount, Number of Terminations:96, Package / Case:96-TFBGA, AS4C512M16D3L-12BIN pinout, AS4C512M16D3L-12BIN datasheet PDF, AS4C512M16D3L-12BIN amp .Beyond Memory Alliance Memory, Inc. AS4C512M16D3L-12BIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C512M16D3L-12BIN


Memory Alliance Memory, Inc. AS4C512M16D3L-12BIN Overview

The Memory Alliance Memory, Inc. AS4C512M16D3L-12BIN is a cutting-edge 8Gbit DRAM component, expertly designed for high-speed and high-volume applications. Utilizing advanced manufacturing technologies from Alliance Memory, Inc., this integrated circuit features a parallel interface and is housed in a compact 96FBGA package, offering robust performance in a variety of demanding environments. This product is ideal for businesses seeking reliable, high-capacity memory solutions to enhance their technology infrastructure.

AS4C512M16D3L-12BIN Features

The AS4C512M16D3L-12BIN IC DRAM boasts several features beneficial for technical applications, including a large 8Gbit capacity and a fast parallel interface, which ensures speedy data transmission and processing. The 96FBGA package is not only space-efficient but also allows for better heat dissipation, enhancing the reliability and longevity of the component under continuous operation.

AS4C512M16D3L-12BIN Applications

  • High-Performance Computing: The large memory capacity and fast data processing capabilities make it suitable for servers and data centers where extensive data handling is crucial.
  • Consumer Electronics: Applies in devices like high-end gaming consoles and smart TVs, where large, fast memory enhances user experiences with improved responsiveness and smoother operation.
  • Telecommunications Equipment: Ideal for use in communication infrastructure, supporting the demanding memory needs of network hardware like routers and switchers for efficient data flow.
  • Automotive Electronics: Can be integrated into advanced driver-assistance systems (ADAS) and infotainment systems, offering the robust data management needed for both performance and safety in vehicles.
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Shipping Method

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Shipping Cost

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