AS4C4M32S-6TIN

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Mfr.Part #
AS4C4M32S-6TIN
Manufacturer
Alliance Memory, Inc.
Package / Case
86-TFSOP (0.400, 10.16mm Width)
Datasheet
Download
Description
IC DRAM 128MBIT PAR 86TSOP II
Stock
15,598
In Stock :
15,598

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Package / Case :
86-TFSOP (0.400, 10.16mm Width)
Additional Feature :
AUTO/SELF REFRESH
Data Bus Width :
32b
Length :
22.22mm
Terminal Position :
Dual
Surface Mount :
yes
Access Time :
5.5ns
HTS Code :
8542.32.00.02
Memory Format :
DRAM
Number of Functions :
1
Density :
128 Mb
Organization :
4MX32
Radiation Hardening :
No
ECCN Code :
EAR99
Supply Voltage :
3.3V
Operating Supply Voltage :
3.3V
Memory Width :
32
Voltage - Supply :
3V~3.6V
Clock Frequency :
166MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Terminal Pitch :
0.5mm
Height Seated (Max) :
1.2mm
Operating Temperature :
-40°C~85°C TA
Max Supply Current :
160mA
Mounting Type :
Surface Mount
Write Cycle Time - Word, Page :
2ns
Published :
2013
Number of Pins :
86
Memory Type :
Volatile
Number of Ports :
1
Number of Terminations :
86
Address Bus Width :
12b
RoHS Status :
RoHS Compliant
Supply Voltage-Max (Vsup) :
3.6V
Supply Voltage-Min (Vsup) :
3V
Memory Size :
128Mb 4M x 32
Packaging :
Tray
Datasheets
AS4C4M32S-6TIN
Introducing Memory Alliance Memory, Inc. AS4C4M32S-6TIN from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:86-TFSOP (0.400, 10.16mm Width), Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Pins:86, Number of Terminations:86, AS4C4M32S-6TIN pinout, AS4C4M32S-6TIN datasheet PDF, AS4C4M32S-6TIN amp .Beyond Memory Alliance Memory, Inc. AS4C4M32S-6TIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C4M32S-6TIN


Memory Alliance Memory, Inc. AS4C4M32S-6TIN Overview

The Memory Alliance Memory, Inc. AS4C4M32S-6TIN IC DRAM represents a robust 128Mbit parallel interface DRAM, encapsulated in an efficient 86TSOP II package. This high-density memory module is engineered to meet the demands of complex digital systems requiring low power consumption and high-speed data retrieval. With its industry-standard packaging and pinout, it offers a reliable solution for designers looking to enhance system performance while maintaining cost-effectiveness and ease of integration. Ideal for bulk purchases by B2B customers, this product ensures durability and consistent performance, critical for industrial and commercial applications.

AS4C4M32S-6TIN Features

This IC DRAM offers a variety of features suitable for demanding applications, including a fast access time and low power operation. Its 86TSOP II package is designed for optimal heat dissipation and minimal footprint on PCBs. The memory's stability and reliability under extended operational periods make it an excellent choice for high-performance computing environments.

AS4C4M32S-6TIN Applications

  • Embedded Systems: Utilized in microcontroller-based applications, enhancing system reliability through increased memory for real-time processing tasks.
  • Consumer Electronics: Essential for devices such as digital cameras and audio players, where large buffer sizes are required for processing large streams of digital data efficiently.
  • Telecommunications: Supports high-speed data operations in telecommunications equipment, aiding in buffer management and data throughput for enhanced communication protocols.
  • Automotive Electronics: Increases performance in automotive infotainment systems, providing robust data management capabilities critical for modern vehicular technology.
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