AS4C4M16S-6TCN
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- Mfr.Part #
- AS4C4M16S-6TCN
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 54-TSOP (0.400, 10.16mm Width)
- Datasheet
- Download
- Description
- IC DRAM 64MBIT PAR 54TSOP II
- Stock
- 20,098
- In Stock ：
- 20,098
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Frequency :
- 166MHz
- Data Bus Width :
- 16b
- Max Frequency :
- 166MHz
- Min Supply Voltage :
- 3V
- Density :
- 64 Mb
- Operating Temperature :
- 0°C~70°C TA
- Number of Pins :
- 54
- Operating Supply Voltage :
- 3.3V
- Access Time :
- 5.4ns
- Package / Case :
- 54-TSOP (0.400, 10.16mm Width)
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Lead Free :
- Lead Free
- Address Bus Width :
- 12b
- Published :
- 2012
- Supplier Device Package :
- 54-TSOP II
- Memory Size :
- 64Mb 4M x 16
- Min Operating Temperature :
- 0°C
- Interface :
- Parallel
- Write Cycle Time - Word, Page :
- 2ns
- Clock Frequency :
- 166MHz
- RoHS Status :
- RoHS Compliant
- Memory Type :
- Volatile
- Max Supply Voltage :
- 3.6V
- Voltage - Supply :
- 3V~3.6V
- Memory Interface :
- Parallel
- Radiation Hardening :
- No
- Memory Format :
- DRAM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Max Operating Temperature :
- 70°C
- Datasheets
- AS4C4M16S-6TCN
Memory Alliance Memory, Inc. AS4C4M16S-6TCN Overview
The Memory Alliance Memory, Inc. AS4C4M16S-6TCN is a high-performance 64Mbit DRAM integrated circuit, designed to meet the rigorous demands of sophisticated electronic applications. This component features a 54TSOP II package, making it ideal for compact systems that require high-density memory solutions. As a product from Alliance Memory, Inc., it is engineered for optimal reliability and performance, providing substantial benefits for B2B customers looking to scale their product development. Its efficient design and robust functionality make it particularly suitable for high-volume manufacturing and deployment in diverse operational environments.
AS4C4M16S-6TCN Features
The AS4C4M16S-6TCN DRAM offers a suite of features that enhance its applicability in commercial and industrial systems. Key features include its parallel interface, which facilitates fast data transfer rates, and its compact 54TSOP II form factor that ensures a minimal footprint on system boards. Additionally, the memory module's operational stability across a range of temperatures underscores its suitability for rigorous applications.
AS4C4M16S-6TCN Applications
- Embedded Systems: Utilized in the core memory function for various embedded applications, ensuring efficient and reliable operation under constrained conditions.
- Consumer Electronics: Empowers high-performance consumer electronics, such as digital cameras and MP3 players, with enhanced data processing and storage capabilities.
- Automotive Electronics: Suitable for use in automotive systems, supporting the advanced computational needs of modern vehicles, from navigation to driver-assistance features.
- Industrial Automation: Provides the memory backbone for automation controllers and industrial PCs, critical for managing complex manufacturing processes.
- Telecommunications: Integral to telecom infrastructure, where reliable and speedy data retention is crucial for system performance and stability.
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