AS4C32M32MD1-5BCN

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Mfr.Part #
AS4C32M32MD1-5BCN
Manufacturer
Alliance Memory, Inc.
Package / Case
90-VFBGA
Datasheet
Download
Description
IC DRAM 1GBIT PARALLEL 90FBGA
Stock
44,990
In Stock :
44,990

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Factory Lead Time :
8 Weeks
Memory Width :
32
Number of Ports :
1
Memory Type :
Volatile
HTS Code :
8542.32.00.32
Additional Feature :
AUTO/SELF REFRESH
Memory Size :
1Gb 32M x 32
Surface Mount :
yes
Clock Frequency :
200MHz
Number of Terminations :
90
ECCN Code :
EAR99
Mounting Type :
Surface Mount
Package / Case :
90-VFBGA
Terminal Pitch :
0.8mm
Height Seated (Max) :
1mm
Operating Temperature :
-25°C~85°C TJ
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Density :
1073741824 bit
RoHS Status :
RoHS Compliant
Organization :
32MX32
Published :
2011
Memory Interface :
Parallel
Operating Mode :
SYNCHRONOUS
Length :
13mm
Voltage - Supply :
1.7V~1.9V
Memory Format :
DRAM
Write Cycle Time - Word, Page :
15ns
Supply Voltage-Min (Vsup) :
1.7V
Supply Voltage-Max (Vsup) :
1.95V
Width :
8mm
Access Time :
5ns
Packaging :
Tray
Number of Pins :
90
Terminal Position :
BOTTOM
Datasheets
AS4C32M32MD1-5BCN
Introducing Memory Alliance Memory, Inc. AS4C32M32MD1-5BCN from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:90, Mounting Type:Surface Mount, Package / Case:90-VFBGA, Operating Temperature:-25°C~85°C TJ, Number of Pins:90, AS4C32M32MD1-5BCN pinout, AS4C32M32MD1-5BCN datasheet PDF, AS4C32M32MD1-5BCN amp .Beyond Memory Alliance Memory, Inc. AS4C32M32MD1-5BCN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C32M32MD1-5BCN


Memory Alliance Memory, Inc. AS4C32M32MD1-5BCN Overview

The Memory Alliance Memory, Inc. AS4C32M32MD1-5BCN is a high-capacity, 1Gbit DRAM chip, expertly crafted to meet the demanding specifications of today's advanced digital systems. With its 90FBGA package, it combines compact design with robust performance capabilities, making it ideal for high-performance applications that require reliable and continuous memory access. The use of advanced circuit technologies ensures low power consumption with high-speed data transfer, enabling efficient operations across a variety of platforms.

AS4C32M32MD1-5BCN Features

This dynamic RAM component features a parallel interface for enhanced data transfer rates and is packaged in a fine-pitch Ball Grid Array (BGA) that allows for efficient thermal management and smaller form factor integration. With a focus on reliability, this memory module supports a wide range of industrial temperatures, making it suitable for both commercial and industrial applications.

AS4C32M32MD1-5BCN Applications

  • Advanced Computing Systems: Utilizes high-speed parallel data transfers to support complex computing tasks and large-scale processing environments.
  • Telecommunications Equipment: Provides the necessary memory capacity and speed for telecommunications systems where rapid data buffering, storage, and retrieval are crucial.
  • Consumer Electronics: Ideal for high-performance consumer electronics that require intensive memory operations, such as gaming consoles and smart TVs.
  • Automotive Electronics: Supports advanced automotive systems, including infotainment and navigation systems that rely on fast data access and high reliability under a range of environmental conditions.
  • Industrial Automation: Enhances the capability of industrial automation systems by providing robust memory solutions that ensure reliable operations in variable conditions.
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Shipping Method

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Shipping Cost

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