AS4C32M16MD1-6BCN

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Mfr.Part #
AS4C32M16MD1-6BCN
Manufacturer
Alliance Memory, Inc.
Package / Case
60-TFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 60FPBGA
Stock
14,232
In Stock :
14,232

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Voltage - Supply :
1.7V~1.9V
Memory Type :
Volatile
Height Seated (Max) :
1mm
ECCN Code :
EAR99
Packaging :
Tray
Supply Voltage :
1.8V
Memory Size :
512Mb 32M x 16
Number of Ports :
1
HTS Code :
8542.32.00.28
Number of Terminations :
60
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Functions :
1
Operating Mode :
SYNCHRONOUS
Supply Voltage-Max (Vsup) :
1.9V
Access Time :
700ps
Memory Density :
536870912 bit
Memory Width :
16
Width :
8mm
Supply Voltage-Min (Vsup) :
1.7V
Clock Frequency :
166MHz
Surface Mount :
yes
Published :
2014
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Write Cycle Time - Word, Page :
15ns
RoHS Status :
RoHS Compliant
Organization :
32MX16
Additional Feature :
AUTO/SELF REFRESH
Terminal Pitch :
0.8mm
Length :
10mm
JESD-30 Code :
R-PBGA-B60
Operating Temperature :
-25°C~85°C TJ
Memory Format :
DRAM
Memory Interface :
Parallel
Package / Case :
60-TFBGA
Datasheets
AS4C32M16MD1-6BCN
Introducing Memory Alliance Memory, Inc. AS4C32M16MD1-6BCN from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:60, Mounting Type:Surface Mount, Operating Temperature:-25°C~85°C TJ, Package / Case:60-TFBGA, AS4C32M16MD1-6BCN pinout, AS4C32M16MD1-6BCN datasheet PDF, AS4C32M16MD1-6BCN amp .Beyond Memory Alliance Memory, Inc. AS4C32M16MD1-6BCN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C32M16MD1-6BCN


Memory Alliance Memory, Inc. AS4C32M16MD1-6BCN Overview

Introducing the Memory Alliance Memory, Inc. AS4C32M16MD1-6BCN, a high-capacity dynamic random-access memory (DRAM) module designed to meet the demanding memory needs of modern electronic devices. With a substantial 512Mbit capacity and a parallel interface, this memory module is engineered for high-speed data processing and optimized power efficiency. Manufactured by Alliance Memory, Inc., a leader in advanced memory solutions, this IC DRAM component is encapsulated in a compact 60-ball FBGA package, ensuring minimal footprint while delivering maximal performance. Ideal for applications requiring dense, high-speed memory, it offers a robust solution for a variety of advanced electronic systems.

AS4C32M16MD1-6BCN Features

  • 512Mbit density for extensive data management.
  • Parallel interface ensures rapid data access and processing.
  • 60-ball Fine-Pitch Ball Grid Array (FBGA) package for reduced space consumption and improved thermal performance.
  • Operates at 1.8V, enhancing energy efficiency and reducing power costs for system designs.
  • Designed to support a wide range of temperatures, making it suitable for diverse operating environments.

AS4C32M16MD1-6BCN Applications

  • Consumer Electronics: Utilized in smartphones, tablets, and gaming consoles where high-density and fast memory are crucial for user experience.
  • Computing Devices: Ideal for laptops and desktops requiring high-speed memory operations for multitasking and complex computations.
  • Automotive Systems: Enhances in-vehicle infotainment and advanced driver assistance systems (ADAS) with reliable, rapid data processing capabilities.
  • Industrial Automation: Supports automation controllers and real-time communication systems with robust memory requirements.
  • Networking Equipment: Applied in routers and switches, facilitating efficient data throughput and buffer management in high-speed networks.
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Shipping Cost

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