AS4C2M32D1-5TIN

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Mfr.Part #
AS4C2M32D1-5TIN
Manufacturer
Alliance Memory, Inc.
Package / Case
Datasheet
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Description
IC DRAM 64MBIT PAR 66TSOP II
Stock
5,179
In Stock :
5,179

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Clock Frequency :
200MHz
Access Time :
700ps
Memory Type :
Volatile
Operating Temperature :
-40°C~85°C TA
Memory Size :
64Mb 2M x 32
Mounting Type :
Surface Mount
Min Operating Temperature :
-40°C
Write Cycle Time - Word, Page :
15ns
Voltage - Supply :
2.3V~2.7V
Frequency :
200MHz
Supplier Device Package :
66-TSOP II
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Interface :
Parallel
RoHS Status :
ROHS3 Compliant
Memory Interface :
Parallel
Max Operating Temperature :
85°C
Memory Format :
DRAM
Packaging :
Tray
Datasheets
AS4C2M32D1-5TIN
Introducing Memory Alliance Memory, Inc. AS4C2M32D1-5TIN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, AS4C2M32D1-5TIN pinout, AS4C2M32D1-5TIN datasheet PDF, AS4C2M32D1-5TIN amp .Beyond Memory Alliance Memory, Inc. AS4C2M32D1-5TIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C2M32D1-5TIN


Memory Alliance Memory, Inc. AS4C2M32D1-5TIN Overview

The Memory Alliance Memory, Inc. AS4C2M32D1-5TIN is a high-performance 64Mbit DRAM integrated circuit, tailored to meet the rigorous demands of advanced computing and storage systems. Manufactured by Alliance Memory, Inc., this IC features a parallel interface and is encapsulated in a 66-pin TSOP II package, designed for optimal reliability and high-speed operation. The robust design and scalability of the AS4C2M32D1-5TIN make it an ideal choice for businesses looking to enhance their hardware with high-capacity and durable memory solutions.

AS4C2M32D1-5TIN Features

  • 64Mbit density - Provides substantial capacity for data-intensive applications.
  • Parallel interface - Ensures fast data transfer rates suitable for high-performance computing environments.
  • 66-pin TSOP II package - Offers a compact footprint and reliable connectivity for ease of integration.
  • Wide temperature range - Capable of operating in extreme conditions, ensuring performance stability.

AS4C2M32D1-5TIN Applications

  • Embedded systems - Utilized in complex computing environments where high density and small form factor are critical.
  • Telecommunication infrastructure - Supports the robust memory needs of telecom systems for enhanced data processing and storage.
  • Automotive electronics - Applied in vehicle systems where reliability and endurance under harsh conditions are essential.
  • Consumer electronics - Ideal for use in consumer devices requiring high-speed memory operations, such as gaming consoles and smart TVs.
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Shipping Method

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Shipping Cost

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