AS4C256M8D3-12BCN

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Mfr.Part #
AS4C256M8D3-12BCN
Manufacturer
Alliance Memory, Inc.
Package / Case
78-TFBGA
Datasheet
Download
Description
IC DRAM 2GBIT PARALLEL 78FBGA
Stock
1,742
In Stock :
1,742

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Memory Size :
2Gb 256M x 8
Surface Mount :
yes
Clock Frequency :
800MHz
Mounting Type :
Surface Mount
Terminal Pitch :
0.8mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Height Seated (Max) :
1.2mm
Operating Temperature :
0°C~90°C TC
Density :
2 GB
Published :
2014
Number of Functions :
1
RoHS Status :
ROHS3 Compliant
Memory Format :
DRAM
Organization :
256MX8
Memory Type :
Volatile
Number of Pins :
78
Operating Supply Voltage :
1.5V
ECCN Code :
EAR99
Address Bus Width :
15b
Number of Ports :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Width :
8
Terminal Position :
BOTTOM
Packaging :
Tray
Operating Mode :
SYNCHRONOUS
Package / Case :
78-TFBGA
Supply Voltage-Max (Vsup) :
1.575V
Supply Voltage-Min (Vsup) :
1.425V
Additional Feature :
AUTO/SELF REFRESH
Supply Voltage :
1.5V
Write Cycle Time - Word, Page :
15ns
Memory Interface :
Parallel
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Voltage - Supply :
1.425V~1.575V
Number of Terminations :
78
Length :
10.5mm
HTS Code :
8542.32.00.36
Access Time :
20ns
Datasheets
AS4C256M8D3-12BCN
Introducing Memory Alliance Memory, Inc. AS4C256M8D3-12BCN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~90°C TC, Number of Pins:78, Package / Case:78-TFBGA, Number of Terminations:78, AS4C256M8D3-12BCN pinout, AS4C256M8D3-12BCN datasheet PDF, AS4C256M8D3-12BCN amp .Beyond Memory Alliance Memory, Inc. AS4C256M8D3-12BCN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C256M8D3-12BCN


Memory Alliance Memory, Inc. AS4C256M8D3-12BCN Overview

Introducing the AS4C256M8D3-12BCN from Alliance Memory, Inc., a high-capacity 2Gbit DRAM integrated circuit that delivers exceptional performance and reliability. Designed for sophisticated electronic applications, this component features a 78FBGA package, enabling compact and efficient designs. The AS4C256M8D3-12BCN is crafted to meet the stringent demands of modern technology systems, providing robust data management and speed. Its compatibility with a parallel interface ensures simplified integration into existing architectures, making it an ideal solution for designers looking to enhance system capabilities while maintaining cost-effectiveness and energy efficiency.

AS4C256M8D3-12BCN Features

The AS4C256M8D3-12BCN Memory module is equipped with several key features that make it a standout choice for tech developers. With its 2Gbit capacity, the module supports extensive data storage and quick access, vital for high-performance applications. The 78FBGA package is not only space-saving but also provides improved thermal management and reduced electrical noise, enhancing the overall reliability and functionality of the device.

AS4C256M8D3-12BCN Applications

  • Consumer Electronics: Utilized in devices such as smart TVs and gaming consoles, the AS4C256M8D3-12BCN provides the necessary speed and capacity to handle intensive multimedia processing and real-time data rendering.
  • Computing: Ideal for use in desktops and laptops, this DRAM chip enhances multitasking capabilities and supports complex computing operations, ensuring smoother user experiences and higher productivity.
  • Telecommunications: In telecom infrastructure, the AS4C256M8D3-12BCN supports systems in data centers and network operations, facilitating faster data throughput and increased reliability in communications.
  • Industrial Applications: This DRAM is also suitable for industrial control systems where reliability and endurance are critical, helping to manage and streamline operations effectively.
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