AS4C256M16D3L-12BIN

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Mfr.Part #
AS4C256M16D3L-12BIN
Manufacturer
Alliance Memory, Inc.
Package / Case
96-TFBGA
Datasheet
Download
Description
IC DRAM 4GBIT PARALLEL 96FBGA
Stock
2,329
In Stock :
2,329

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Surface Mount :
yes
Additional Feature :
AUTO/SELF REFRESH
Supply Voltage :
1.35V
Lead Free :
Lead Free
Supply Voltage-Min (Vsup) :
1.283V
Length :
13mm
Packaging :
Tray
Memory Interface :
Parallel
Operating Temperature :
-40°C~95°C TC
Access Time :
20ns
Height Seated (Max) :
1.2mm
Supply Voltage-Max (Vsup) :
1.45V
HTS Code :
8542.32.00.36
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
1.283V~1.45V
ECCN Code :
EAR99
Address Bus Width :
15b
Memory Format :
DRAM
Published :
2014
Density :
4 GB
Memory Type :
Volatile
Operating Supply Voltage :
1.35V
Terminal Pitch :
0.8mm
Clock Frequency :
800MHz
Number of Terminations :
96
Write Cycle Time - Word, Page :
15ns
Mounting Type :
Surface Mount
Package / Case :
96-TFBGA
Operating Mode :
SYNCHRONOUS
Memory Width :
16
Number of Functions :
1
Number of Ports :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Pins :
96
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Organization :
256MX16
Memory Size :
4Gb 256M x 16
Terminal Position :
BOTTOM
Introducing Memory Alliance Memory, Inc. AS4C256M16D3L-12BIN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~95°C TC, Number of Terminations:96, Mounting Type:Surface Mount, Package / Case:96-TFBGA, Number of Pins:96, AS4C256M16D3L-12BIN pinout, AS4C256M16D3L-12BIN datasheet PDF, AS4C256M16D3L-12BIN amp .Beyond Memory Alliance Memory, Inc. AS4C256M16D3L-12BIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C256M16D3L-12BIN


Memory Alliance Memory, Inc. AS4C256M16D3L-12BIN Overview

The Memory Alliance Memory, Inc. AS4C256M16D3L-12BIN is a high-performance 4Gbit DRAM IC designed for advanced computing and high-volume data processing needs. This component utilizes a 96FBGA package that is ideal for achieving compact, high-density system designs. The AS4C256M16D3L-12BIN offers exceptional speed and reliability, ensuring efficient operation in a range of demanding applications. Its integration capabilities make it particularly appealing for manufacturers looking to streamline their product designs while maximizing performance and minimizing power consumption.

AS4C256M16D3L-12BIN Features

This dynamic RAM integrates several features aimed at enhancing performance, including a parallel interface for high-speed data transfer and a dense 96FBGA package that minimizes PCB space requirements. The module operates at a speed grade of -12BIN, making it suitable for applications requiring fast data access and high throughput. The advanced architecture of the AS4C256M16D3L-12BIN allows for scalable configurations in system designs, catering to both current and future technological needs.

AS4C256M16D3L-12BIN Applications

  • Consumer Electronics: Utilized in smartphones, tablets, and high-performance gaming consoles to manage fast and efficient processing of large volumes of data.
  • Networking Hardware: Employed in routers and switches, this DRAM ensures efficient data buffering and high-speed packet processing, crucial for maintaining network performance.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) for real-time processing and storage of sensor data, improving vehicle response times and safety measures.
  • Industrial Automation: Integral in PLCs and industrial PCs, where robust data handling capabilities are essential for complex automation tasks and real-time control systems.
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Shipping Method

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Shipping Cost

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