AS4C256M16D3-12BCN

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Mfr.Part #
AS4C256M16D3-12BCN
Manufacturer
Alliance Memory, Inc.
Package / Case
96-TFBGA
Datasheet
Download
Description
IC DRAM 4GBIT PARALLEL 96FBGA
Stock
36,182
In Stock :
36,182

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Operating Temperature :
0°C~95°C TC
ECCN Code :
EAR99
Memory Format :
DRAM
Address Bus Width :
15b
Clock Frequency :
800MHz
Operating Mode :
SYNCHRONOUS
Access Time :
20ns
Number of Pins :
96
Published :
2014
Height Seated (Max) :
1.2mm
Terminal Pitch :
0.8mm
Supply Voltage-Max (Vsup) :
1.575V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Terminations :
96
Supply Voltage :
1.5V
RoHS Status :
ROHS3 Compliant
Length :
13mm
Operating Supply Voltage :
1.5V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Organization :
256MX16
Memory Width :
16
HTS Code :
8542.32.00.36
Density :
4 GB
Package / Case :
96-TFBGA
Additional Feature :
AUTO/SELF REFRESH
Factory Lead Time :
12 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Packaging :
Tray
Memory Type :
Volatile
Memory Interface :
Parallel
Number of Functions :
1
Surface Mount :
yes
Memory Size :
4Gb 256M x 16
Number of Ports :
1
Voltage - Supply :
1.425V~1.575V
Supply Voltage-Min (Vsup) :
1.425V
Lead Free :
Lead Free
Terminal Position :
BOTTOM
Write Cycle Time - Word, Page :
15ns
Introducing Memory Alliance Memory, Inc. AS4C256M16D3-12BCN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~95°C TC, Number of Pins:96, Number of Terminations:96, Package / Case:96-TFBGA, Mounting Type:Surface Mount, AS4C256M16D3-12BCN pinout, AS4C256M16D3-12BCN datasheet PDF, AS4C256M16D3-12BCN amp .Beyond Memory Alliance Memory, Inc. AS4C256M16D3-12BCN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C256M16D3-12BCN


Memory Alliance Memory, Inc. AS4C256M16D3-12BCN Overview

The Memory Alliance Memory, Inc. AS4C256M16D3-12BCN is a high-performance 4Gbit DRAM integrated circuit, designed to meet the demands of high-throughput, data-intensive applications. Housed in a compact 96FBGA package, this memory module is engineered for optimized power efficiency and superior reliability. Its advanced design ensures compatibility with a broad range of industrial and commercial applications, making it a prime choice for businesses seeking robust memory solutions that support extended lifecycle requirements and reduced system downtime.

AS4C256M16D3-12BCN Features

This DRAM IC features a parallel interface, providing rapid data transfer rates that are essential for high-speed computing environments. The 4Gbit density allows substantial storage within a single chip, facilitating sleeker and more compact system designs without compromising on capacity. Additionally, its standardized 96FBGA packaging ensures thermal stability and simplifies the integration process into existing and new designs, enhancing overall system robustness.

AS4C256M16D3-12BCN Applications

  • Enterprise Servers: Provides high-density, high-throughput memory necessary for managing large databases and complex applications in enterprise server environments.
  • Telecommunications Equipment: Supports the robust memory requirements needed for telecommunications infrastructure, including switches and routing equipment.
  • Automotive Electronics: Suitable for use in advanced driver-assistance systems (ADAS) where rapid data processing and storage reliability are critical.
  • Portable Computing Devices: Ideal for laptops and tablets, enhancing multitasking capabilities and extending battery life through efficient power management.
  • Industrial Automation Systems: Ensures reliable and continuous operation in challenging industrial settings, supporting process control and automation machinery.
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Shipping Cost

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