AS4C256M16D3-12BCN
- Mfr.Part #
- AS4C256M16D3-12BCN
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 96-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 4GBIT PARALLEL 96FBGA
- Stock
- 36,182
- In Stock :
- 36,182
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Operating Temperature :
- 0°C~95°C TC
- ECCN Code :
- EAR99
- Memory Format :
- DRAM
- Address Bus Width :
- 15b
- Clock Frequency :
- 800MHz
- Operating Mode :
- SYNCHRONOUS
- Access Time :
- 20ns
- Number of Pins :
- 96
- Published :
- 2014
- Height Seated (Max) :
- 1.2mm
- Terminal Pitch :
- 0.8mm
- Supply Voltage-Max (Vsup) :
- 1.575V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Terminations :
- 96
- Supply Voltage :
- 1.5V
- RoHS Status :
- ROHS3 Compliant
- Length :
- 13mm
- Operating Supply Voltage :
- 1.5V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Organization :
- 256MX16
- Memory Width :
- 16
- HTS Code :
- 8542.32.00.36
- Density :
- 4 GB
- Package / Case :
- 96-TFBGA
- Additional Feature :
- AUTO/SELF REFRESH
- Factory Lead Time :
- 12 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Memory Type :
- Volatile
- Memory Interface :
- Parallel
- Number of Functions :
- 1
- Surface Mount :
- yes
- Memory Size :
- 4Gb 256M x 16
- Number of Ports :
- 1
- Voltage - Supply :
- 1.425V~1.575V
- Supply Voltage-Min (Vsup) :
- 1.425V
- Lead Free :
- Lead Free
- Terminal Position :
- BOTTOM
- Write Cycle Time - Word, Page :
- 15ns
- Datasheets
- AS4C256M16D3-12BCN

Memory Alliance Memory, Inc. AS4C256M16D3-12BCN Overview
The Memory Alliance Memory, Inc. AS4C256M16D3-12BCN is a high-performance 4Gbit DRAM integrated circuit, designed to meet the demands of high-throughput, data-intensive applications. Housed in a compact 96FBGA package, this memory module is engineered for optimized power efficiency and superior reliability. Its advanced design ensures compatibility with a broad range of industrial and commercial applications, making it a prime choice for businesses seeking robust memory solutions that support extended lifecycle requirements and reduced system downtime.
AS4C256M16D3-12BCN Features
This DRAM IC features a parallel interface, providing rapid data transfer rates that are essential for high-speed computing environments. The 4Gbit density allows substantial storage within a single chip, facilitating sleeker and more compact system designs without compromising on capacity. Additionally, its standardized 96FBGA packaging ensures thermal stability and simplifies the integration process into existing and new designs, enhancing overall system robustness.
AS4C256M16D3-12BCN Applications
- Enterprise Servers: Provides high-density, high-throughput memory necessary for managing large databases and complex applications in enterprise server environments.
- Telecommunications Equipment: Supports the robust memory requirements needed for telecommunications infrastructure, including switches and routing equipment.
- Automotive Electronics: Suitable for use in advanced driver-assistance systems (ADAS) where rapid data processing and storage reliability are critical.
- Portable Computing Devices: Ideal for laptops and tablets, enhancing multitasking capabilities and extending battery life through efficient power management.
- Industrial Automation Systems: Ensures reliable and continuous operation in challenging industrial settings, supporting process control and automation machinery.
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