AS4C16M16S-6TCN
- Mfr.Part #
- AS4C16M16S-6TCN
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 54-TSOP (0.400, 10.16mm Width)
- Datasheet
- Download
- Description
- IC DRAM 256MBIT PAR 54TSOP II
- Stock
- 3,748
- In Stock :
- 3,748
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Frequency :
- 166MHz
- Max Operating Temperature :
- 70°C
- Memory Size :
- 256Mb 16M x 16
- Max Frequency :
- 166MHz
- Lead Free :
- Lead Free
- Voltage - Supply :
- 3V~3.6V
- Mounting Type :
- Surface Mount
- Interface :
- Parallel
- Supplier Device Package :
- 54-TSOP II
- Published :
- 2010
- Radiation Hardening :
- No
- Memory Type :
- Volatile
- Number of Pins :
- 54
- Data Bus Width :
- 16b
- RoHS Status :
- RoHS Compliant
- Write Cycle Time - Word, Page :
- 12ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Max Supply Voltage :
- 3.6V
- Memory Format :
- DRAM
- Address Bus Width :
- 13b
- Packaging :
- Tray
- Operating Supply Voltage :
- 3.3V
- Package / Case :
- 54-TSOP (0.400, 10.16mm Width)
- Operating Temperature :
- 0°C~70°C TA
- Density :
- 256 Mb
- Clock Frequency :
- 166MHz
- Min Supply Voltage :
- 3V
- Memory Interface :
- Parallel
- Min Operating Temperature :
- 0°C
- Access Time :
- 5.4ns
- Datasheets
- AS4C16M16S-6TCN

Memory Alliance Memory, Inc. AS4C16M16S-6TCN Overview
Introducing the AS4C16M16S-6TCN from Alliance Memory, Inc., a high-performance IC DRAM designed to deliver robust speed and reliability for advanced memory requirements. This 256Mbit DRAM, packaged in a compact 54TSOP II format, is engineered to meet the demanding specifications required by contemporary digital devices. The Memory Alliance Memory, Inc. AS4C16M16S-6TCN excels in environments requiring high-volume, high-speed data processing and storage, making it an ideal choice for manufacturers looking to enhance their systems' performance with reliable and efficient memory solutions.
AS4C16M16S-6TCN Features
The AS4C16M16S-6TCN DRAM module offers several key features that make it a standout choice for system designers. These include its large 256Mbit capacity and the use of the parallel interface, which allows for higher data transfer rates and reduced latency. The 54TSOP II package is not only space-efficient but also ensures enhanced thermal stability and durability under a range of environmental conditions. These characteristics ensure that the device operates reliably in a variety of settings, providing consistent performance and extending the lifecycle of electronic systems.
AS4C16M16S-6TCN Applications
- Consumer Electronics: Used in devices such as smartphones, tablets, and personal computers where high-density, fast memory is crucial for user experience and device responsiveness.
- Gaming Systems: Enhances gaming consoles' capability to handle complex graphics and rapid loading times, providing a smoother and more immersive gaming experience.
- Automotive Systems: Integral for advanced driver-assistance systems (ADAS) that require high-speed data processing to perform real-time decision making for safety and navigation aids.
- Industrial Automation: In industrial environments, this memory can manage large-scale data operations, crucial for control systems and real-time processing tasks.
- Telecommunication Infrastructure: Supports telecommunications equipment in managing vast amounts of data, improving efficiency and reliability in network operations and data centers.
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