AS4C128M32MD2-18BCN

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Mfr.Part #
AS4C128M32MD2-18BCN
Manufacturer
Alliance Memory, Inc.
Package / Case
134-VFBGA
Datasheet
Download
Description
IC DRAM 4GBIT PARALLEL 134FBGA
Stock
10,986
In Stock :
10,986

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Operating Temperature :
-25°C~85°C TC
Published :
2017
Width :
11.5mm
Mounting Type :
Surface Mount
Factory Lead Time :
8 Weeks
Number of Ports :
1
Memory Type :
Volatile
Organization :
128MX32
JESD-30 Code :
S-PBGA-B134
Memory Density :
4294967296 bit
Terminal Position :
BOTTOM
Length :
11.5mm
RoHS Status :
Non-RoHS Compliant
Additional Feature :
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY
Height Seated (Max) :
0.8mm
Supply Voltage-Max (Vsup) :
1.3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Access Mode :
MULTI BANK PAGE BURST
Operating Mode :
SYNCHRONOUS
Surface Mount :
yes
Number of Terminations :
134
Supply Voltage :
1.2V
Memory Size :
4Gb 128M x 32
Memory Format :
DRAM
Terminal Pitch :
0.65mm
Write Cycle Time - Word, Page :
15ns
Memory Width :
32
Voltage - Supply :
1.14V~1.95V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Packaging :
Tray
Memory Interface :
Parallel
Clock Frequency :
533MHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Functions :
1
Supply Voltage-Min (Vsup) :
1.14V
Package / Case :
134-VFBGA
Introducing Memory Alliance Memory, Inc. AS4C128M32MD2-18BCN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-25°C~85°C TC, Mounting Type:Surface Mount, Number of Terminations:134, Package / Case:134-VFBGA, AS4C128M32MD2-18BCN pinout, AS4C128M32MD2-18BCN datasheet PDF, AS4C128M32MD2-18BCN amp .Beyond Memory Alliance Memory, Inc. AS4C128M32MD2-18BCN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C128M32MD2-18BCN


Memory Alliance Memory, Inc. AS4C128M32MD2-18BCN Overview

The Memory Alliance Memory, Inc. AS4C128M32MD2-18BCN is a high-capacity, 4Gbit dynamic random-access memory (DRAM) component engineered for exceptional performance and efficiency. Designed using a 134-ball fine-pitch ball grid array (FBGA) package, this IC is an essential solution for applications requiring large-scale memory storage and rapid data access. Its robust architecture and compatibility with a wide voltage range make it ideal for advanced computing and digital processing environments. The utilization of this Memory Alliance Memory, Inc. AS4C128M32MD2-18BCN ensures optimal performance in high-demand systems, facilitating enhanced system responsiveness and multi-tasking capabilities that are critical for business and industrial applications.

AS4C128M32MD2-18BCN Features

This IC DRAM from Alliance Memory features a 4Gbit storage capacity, allowing extensive data handling and storage. It operates at a speed grade of -18BCN, offering high-speed data transfer rates that are suitable for advanced computing needs. The 134FBGA packaging not only reduces the physical footprint but also enhances thermal performance and reliability in tight spaces. Moreover, its parallel interface provides a straightforward integration with existing and new hardware, ensuring a seamless upgrade path for system developers.

AS4C128M32MD2-18BCN Applications

  • Computing Systems: Utilized in servers and high-performance computers where large memory capacity and speed are crucial for efficient data processing and multitasking.
  • Consumer Electronics: Embedded in devices such as high-end gaming consoles and smart TVs, which require substantial memory for graphic processing and user interface enhancements.
  • Mobile Communication Devices: Integral for smartphones and tablets that need high memory capacity for running multiple applications simultaneously and storing large volumes of data.
  • Industrial Automation: Applied in industrial computers and automation systems that require robust memory solutions for complex processing tasks in manufacturing and control systems.
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