ADSP-BF703KBCZ-3
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- Mfr.Part #
- ADSP-BF703KBCZ-3
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 184-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC DSP LP 256KB L2SR 184BGA
- Stock
- 2,271
- In Stock ：
- 2,271
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- DSP (Digital Signal Processors)
- Number of Pins :
- 184
- Operating Temperature :
- 0°C~70°C TA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Type :
- Blackfin+
- Factory Lead Time :
- 8 Weeks
- Boundary Scan :
- yes
- Supply Voltage-Max (Vsup) :
- 1.9V
- Non-Volatile Memory :
- ROM (512kB)
- Memory Size :
- 512kB
- Terminal Pitch :
- 0.8mm
- RAM Size :
- 256KB
- Supply Voltage :
- 1.8V
- Internal Bus Architecture :
- Multiple
- Barrel Shifter :
- yes
- Terminal Form :
- Ball
- Supply Voltage-Min (Vsup) :
- 1.7V
- Mounting Type :
- Surface Mount
- Lead Free :
- Contains Lead
- Mount :
- Surface Mount
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Base Part Number :
- ADSP-BF703
- Lifecycle Status :
- Production (Last Updated: 2 weeks ago)
- Series :
- Blackfin®
- Package / Case :
- 184-LFBGA, CSPBGA
- Additional Feature :
- IT ALSO OPERATES AT 3.3V NOM SUPPLY
- Peak Reflow Temperature (Cel) :
- 260
- Format :
- FIXED POINT
- Voltage - Core :
- 1.10V
- Low Power Mode :
- yes
- Interface :
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Max Frequency :
- 300MHz
- Number of Terminations :
- 184
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 1.7mm
- RoHS Status :
- ROHS3 Compliant
- Voltage - I/O :
- 1.8V 3.3V
- Terminal Position :
- BOTTOM
- Pin Count :
- 184
- Number of UART Channels :
- 2
- JESD-609 Code :
- e1
- Datasheets
- ADSP-BF703KBCZ-3
DSP Analog Devices, Inc. ADSP-BF703KBCZ-3 Overview
The ADSP-BF703KBCZ-3, a cutting-edge low-power Digital Signal Processor from Analog Devices, Inc., is designed to meet the demanding needs of embedded signal processing applications. This DSP is engineered to offer robust performance with a low-power footprint, making it ideal for applications that require efficient signal processing without compromising on power consumption. The ADSP-BF703KBCZ-3 integrates 256KB of L2 SRAM, housed in a compact 184-Ball Grid Array (BGA) package, providing ample memory and ease of integration into various systems. With its advanced processing capabilities, this DSP is an excellent choice for developers looking to harness powerful digital signal processing in compact and power-sensitive applications.
ADSP-BF703KBCZ-3 Features
- Low Power Consumption: Optimized for applications that demand minimal power usage without sacrificing performance.
- 256KB L2 SRAM: Offers sufficient memory for complex algorithms and buffer storage, enhancing system reliability and responsiveness.
- Compact 184BGA Package: Enables smaller and more efficient system designs, perfect for space-constrained applications.
- High Integration: Supports a wide range of interfaces and peripherals, reducing external component count and system cost.
ADSP-BF703KBCZ-3 Applications
- Audio Processing: Enhances audio quality in systems by providing advanced algorithms for sound enhancement and noise reduction.
- Industrial Control Systems: Manages and optimizes operations in industrial settings, improving process efficiency and safety.
- Automotive Electronics: Powers advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors to enhance vehicle safety and functionality.
- Portable Devices: Optimizes power consumption for battery-operated devices, ensuring longer operation times and reliability.
- Medical Devices: Processes complex biomedical signals in real-time to support critical health monitoring and diagnostic systems.
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