ADSP-BF702BCPZ-4
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- Mfr.Part #
- ADSP-BF702BCPZ-4
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 88-VFQFN Exposed Pad, CSP
- Datasheet
- Download
- Description
- IC DSP LP 256KB L2SR 88LFCSP
- Stock
- 1,548
- In Stock ：
- 1,548
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- DSP (Digital Signal Processors)
- Voltage - Core :
- 1.10V
- Voltage - I/O :
- 1.8V 3.3V
- Terminal Pitch :
- 0.5mm
- RAM Size :
- 256KB
- Base Part Number :
- ADSP-BF702
- Barrel Shifter :
- yes
- Frequency :
- 400MHz
- Number of Pins :
- 88
- Series :
- Blackfin®
- Terminal Form :
- NO LEAD
- Number of UART Channels :
- 2
- Height Seated (Max) :
- 0.9mm
- Additional Feature :
- IT ALSO OPERATES AT 3.3V NOM SUPPLY
- Pbfree Code :
- No
- Supply Voltage :
- 1.8V
- Non-Volatile Memory :
- ROM (512kB)
- Supply Voltage-Max (Vsup) :
- 1.9V
- Packaging :
- Tray
- Terminal Finish :
- Matte Tin (Sn)
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Pin Count :
- 88
- Factory Lead Time :
- 8 Weeks
- Package / Case :
- 88-VFQFN Exposed Pad, CSP
- Low Power Mode :
- yes
- RoHS Status :
- ROHS3 Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage-Min (Vsup) :
- 1.7V
- Interface :
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lifecycle Status :
- Production (Last Updated: 1 week ago)
- Boundary Scan :
- yes
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Position :
- QUAD
- JESD-609 Code :
- e3
- Type :
- Blackfin+
- Internal Bus Architecture :
- Multiple
- Operating Temperature :
- -40°C~85°C TA
- Format :
- FIXED POINT
- Number of Terminations :
- 88
- Lead Free :
- Contains Lead
- Datasheets
- ADSP-BF702BCPZ-4
DSP Analog Devices, Inc. ADSP-BF702BCPZ-4 Overview
The DSP Analog Devices, Inc. ADSP-BF702BCPZ-4 is a high-performance digital signal processor specifically engineered to meet the demands of low-power applications requiring significant computational capabilities. This IC is built to handle complex algorithms with efficiency, featuring 256KB of L2 SRAM which allows for rapid data access and processing. The compact 88-lead LFCSP package ensures that it can be incorporated into space-constrained environments without sacrificing performance. This product is ideal for businesses looking to integrate a powerful DSP into their product line while managing power consumption and maintaining small form factors.
ADSP-BF702BCPZ-4 Features
- Low-power DSP core optimized for performance and efficiency
- 256KB of L2 SRAM for high-speed data processing
- Compact 88-lead LFCSP packaging suitable for space-constrained applications
- Enhanced signal processing capabilities for complex algorithms
- Designed for scalable applications, facilitating both small and large volume productions
ADSP-BF702BCPZ-4 Applications
- Automotive Audio Systems: Integrates with automotive infotainment systems to provide advanced audio processing capabilities that enhance user experience.
- Portable Medical Devices: Utilizes its low power consumption and efficient processing to support portable medical devices for real-time patient monitoring and diagnostics.
- Industrial Automation: Acts as a control unit within automation systems, processing numerous sensor inputs to facilitate complex manufacturing processes.
- Communications Infrastructure: Supports communication protocols and processes high-speed signals to improve data transmission reliability in network equipment.
- Consumer Electronics: Empowers high-performance audio and video processing in devices such as smart TVs and gaming consoles, ensuring smooth media playback and interaction.
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