ADSP-BF702BCPZ-3
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- Mfr.Part #
- ADSP-BF702BCPZ-3
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 88-VFQFN Exposed Pad, CSP
- Datasheet
- Download
- Description
- IC DSP LP 256KB L2SR 88LFCSP
- Stock
- 777
- In Stock ：
- 777
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- DSP (Digital Signal Processors)
- Frequency :
- 300MHz
- Barrel Shifter :
- yes
- Packaging :
- Tray
- Series :
- Blackfin®
- Terminal Finish :
- Matte Tin (Sn)
- Mounting Type :
- Surface Mount
- Lead Free :
- Contains Lead
- Interface :
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Voltage - Core :
- 1.10V
- Base Part Number :
- ADSP-BF702
- Supply Voltage-Min (Vsup) :
- 1.7V
- Mount :
- Surface Mount
- Height Seated (Max) :
- 0.9mm
- Terminal Pitch :
- 0.5mm
- Supply Voltage-Max (Vsup) :
- 1.9V
- Non-Volatile Memory :
- ROM (512kB)
- JESD-609 Code :
- e3
- Lifecycle Status :
- Production (Last Updated: 1 month ago)
- Internal Bus Architecture :
- Multiple
- RAM Size :
- 256KB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of UART Channels :
- 2
- Terminal Position :
- QUAD
- Format :
- FIXED POINT
- Number of Terminations :
- 88
- Supply Voltage :
- 1.8V
- Operating Temperature :
- -40°C~85°C TA
- Number of Pins :
- 88
- Type :
- Blackfin+
- Voltage - I/O :
- 1.8V 3.3V
- Peak Reflow Temperature (Cel) :
- 260
- Factory Lead Time :
- 8 Weeks
- Additional Feature :
- IT ALSO OPERATES AT 3.3V NOM SUPPLY
- Memory Size :
- 512kB
- Pbfree Code :
- No
- Low Power Mode :
- yes
- Boundary Scan :
- yes
- Pin Count :
- 88
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 88-VFQFN Exposed Pad, CSP
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- NO LEAD
- Datasheets
- ADSP-BF702BCPZ-3
DSP Analog Devices, Inc. ADSP-BF702BCPZ-3 Overview
The DSP Analog Devices, Inc. ADSP-BF702BCPZ-3 is a highly efficient, low-power digital signal processor designed to meet the rigorous demands of embedded processing applications. This IC DSP LP (low power) integrates 256KB of L2 SRAM, providing robust data storage and retrieval capabilities, essential for high-speed signal processing tasks. Housed in an 88-lead LFCSP (lead-frame chip scale package), it offers a compact footprint ideal for space-constrained applications while delivering optimal thermal performance and reliability. The ADSP-BF702BCPZ-3 is engineered to deliver superior performance in processing complex algorithms rapidly, making it an indispensable component in various high-tech integrations.
ADSP-BF702BCPZ-3 Features
The ADSP-BF702BCPZ-3 includes several key features that make it a standout choice for integrating into modern electronics systems. Its low-power consumption is crucial for battery-dependent devices, while the 256KB of L2 SRAM facilitates advanced signal processing capabilities without compromising speed or efficiency. The 88LFCSP packaging not only ensures a minimal physical footprint but also enhances the device's overall durability and heat dissipation, which is critical in maintaining long-term performance stability.
ADSP-BF702BCPZ-3 Applications
- Automotive Audio Systems: Enhances sound quality through sophisticated signal processing algorithms, improving audio clarity and detail in automotive environments.
- Portable Medical Devices: Utilizes its low-power operation to extend battery life while providing fast, reliable signal processing for critical medical monitoring and diagnostics.
- Industrial Automation: Supports robust and efficient processing of control signals necessary for managing complex industrial machinery with precision and reliability.
- Consumer Electronics: Empowers high-performance audio and visual processing in devices such as smartphones and tablets, ensuring smooth and responsive user experiences.
- Wireless Communication Systems: Facilitates the processing of digital signals for clear and reliable communication in wireless infrastructure and mobile devices.
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