ADSP-BF701BBCZ-2
- Mfr.Part #
- ADSP-BF701BBCZ-2
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 184-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC DSP LP 128KB L2SR 184BGA
- Stock
- 26
- In Stock :
- 26
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- DSP (Digital Signal Processors)
- Lead Free :
- Contains Lead
- Format :
- FIXED POINT
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Boundary Scan :
- yes
- Factory Lead Time :
- 8 Weeks
- Peak Reflow Temperature (Cel) :
- 260
- Voltage - Core :
- 1.10V
- Mount :
- Surface Mount
- Internal Bus Architecture :
- Multiple
- Pbfree Code :
- No
- Terminal Pitch :
- 0.8mm
- Base Part Number :
- ADSP-BF701
- RAM Size :
- 128kB
- Number of UART Channels :
- 2
- Series :
- Blackfin®
- Low Power Mode :
- yes
- Voltage - I/O :
- 1.8V 3.3V
- RoHS Status :
- ROHS3 Compliant
- Number of Terminations :
- 184
- Terminal Position :
- BOTTOM
- Operating Temperature :
- -40°C~85°C TA
- Type :
- Blackfin+
- Additional Feature :
- IT ALSO OPERATES AT 3.3V NOM SUPPLY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 184-LFBGA, CSPBGA
- Non-Volatile Memory :
- ROM (512kB)
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Memory Size :
- 512kB
- Supply Voltage-Max (Vsup) :
- 1.9V
- JESD-609 Code :
- e1
- Number of Pins :
- 184
- Lifecycle Status :
- Production (Last Updated: 2 weeks ago)
- Supply Voltage :
- 1.8V
- Supply Voltage-Min (Vsup) :
- 1.7V
- Packaging :
- Tray
- Pin Count :
- 184
- Height Seated (Max) :
- 1.7mm
- Frequency :
- 200MHz
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Barrel Shifter :
- yes
- Interface :
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Datasheets
- ADSP-BF701BBCZ-2

DSP Analog Devices, Inc. ADSP-BF701BBCZ-2 Overview
Introducing the ADSP-BF701BBCZ-2, a high-performance Digital Signal Processor (DSP) from Analog Devices, Inc. This processor is engineered to deliver superior signal processing capabilities with low power consumption. Its compact 184-BGA package integrates 128KB of L2 SRAM, making it an ideal choice for demanding embedded applications where efficiency and space are critical. The DSP Analog Devices, Inc. ADSP-BF701BBCZ-2 excels in environments that require robust computational strength to handle complex algorithms while maintaining power efficiency. This product is particularly suitable for businesses looking to enhance their technological infrastructure with scalable, high-speed signal processing functionalities.
ADSP-BF701BBCZ-2 Features
The ADSP-BF701BBCZ-2 is packed with features that make it a versatile and powerful component for a wide range of applications. Key features include its low power consumption, which allows for efficient operation even in power-sensitive scenarios. The integrated 128KB L2 SRAM provides ample storage for temporary data during processing, enhancing the device's overall performance. Additionally, its 184-BGA packaging ensures a compact footprint, making it ideal for space-constrained applications. The processor's advanced signal processing capabilities enable it to handle complex algorithms with ease, providing reliability and high performance.
ADSP-BF701BBCZ-2 Applications
- Automotive Audio Systems: Utilized to enhance audio signal processing for clearer and more refined sound output in vehicle infotainment systems.
- Industrial Automation: Powers advanced control systems, improving efficiency and precision in automated machinery and robotics.
- Medical Imaging Devices: Employs its robust processing power to handle complex image data, facilitating faster and more accurate medical diagnostics.
- Telecommunications: Key component in communication infrastructure, enabling efficient processing of high-speed data signals for better network performance.
- Consumer Electronics: Enhances user experience in devices like digital cameras and home entertainment systems through superior signal processing.
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