AD9777BSV

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Mfr.Part #
AD9777BSV
Manufacturer
Analog Devices, Inc.
Package / Case
80-TQFP Exposed Pad
Datasheet
Download
Description
IC DAC 16BIT DUAL 160MSPS 80TQFP
Stock
875
In Stock :
875

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Manufacturer :
Analog Devices, Inc.
Product Category :
Digital to Analog Converters (DAC)
Lead Free :
Contains Lead
Min Output Voltage :
100mV
Sampling Rate :
400 Msps
Number of Functions :
1
Pin Count :
80
Packaging :
Tray
Reference Type :
External, Internal
Number of Converters :
2
Package / Case :
80-TQFP Exposed Pad
Time@Peak Reflow Temperature-Max (s) :
40
Nominal Supply Current :
72.5mA
Operating Supply Voltage :
3.3V
Signal to Noise Ratio (SNR) :
79 dB
Max Output Voltage :
2.5V
Mounting Type :
Surface Mount
Max Input Voltage :
1.25V
Power Dissipation :
410mW
Max Supply Voltage :
3.5V
Contact Plating :
Tin
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
QUAD
Lifecycle Status :
Production (Last Updated: 2 weeks ago)
Series :
TxDAC+®
Number of Pins :
80
JESD-609 Code :
e3
Conversion Rate :
400 Msps
Interface :
Parallel, SPI
Output Type :
Current - Unbuffered
Differential Output :
yes
Min Input Voltage :
100mV
Terminal Form :
Gull wing
Peak Reflow Temperature (Cel) :
260
Length :
14mm
Terminal Pitch :
0.5mm
Height :
1mm
Number of Bits :
16
Voltage - Supply, Digital :
3.1V~3.5V
Supply Voltage :
3.3V
Min Supply Voltage :
3.1V
Data Interface :
Parallel
Factory Lead Time :
12 Weeks
RoHS Status :
ROHS3 Compliant
Converter Type :
D/A CONVERTER
Radiation Hardening :
No
Number of Terminations :
80
Base Part Number :
AD9777
ECCN Code :
EAR99
Pbfree Code :
No
Architecture :
Oversampling Interpolating DAC
Max Power Dissipation :
410mW
Operating Temperature :
-40°C~85°C
REACH SVHC :
No SVHC
INL/DNL (LSB) :
±6, ±3
Settling Time :
11μs (Typ)
Voltage - Supply, Analog :
3.1V~3.5V
Integral Nonlinearity (INL) :
6 LSB
Surface Mount :
yes
Resolution :
2 B
Width :
14mm
Datasheets
AD9777BSV
Introducing Digital to Analog Converters (DAC) Analog Devices, Inc. AD9777BSV from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:80-TQFP Exposed Pad, Mounting Type:Surface Mount, Number of Pins:80, Number of Terminations:80, Base Part Number:AD9777, Operating Temperature:-40°C~85°C, AD9777BSV pinout, AD9777BSV datasheet PDF, AD9777BSV amp .Beyond Digital to Analog Converters (DAC) Analog Devices, Inc. AD9777BSV ,we also offer MCP4822T-E/SN, TLV5620ID, TLC5615IDR, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. AD9777BSV


Digital to Analog Converters (DAC) Analog Devices, Inc. AD9777BSV Overview

Introducing the AD9777BSV, a high-performance 16-bit dual Digital to Analog Converter (DAC) from Analog Devices, Inc., designed for sophisticated signal generation with a maximum sampling rate of 160 MSPS. This component is housed in a compact 80TQFP package, optimizing board space without compromising on functionality. The AD9777BSV is engineered to deliver precision and speed, making it ideal for a wide range of demanding applications where accuracy and rapid data processing are critical. This product stands out in the market for its robust performance and flexibility, accommodating various data rates and signal quality requirements, essential for high-end industrial, communication, and testing equipment.

AD9777BSV Features

The AD9777BSV boasts several key features that make it a superior choice for system designers. It offers dual 16-bit DAC channels, which allow for simultaneous output of two independent analog signals. The high sampling rate of up to 160 MSPS ensures minimal latency and high fidelity in signal reproduction. Furthermore, the 80TQFP packaging is designed for efficient thermal management and reduced footprint on PCB layouts. Additional features include versatile interfacing capabilities with digital signal processors (DSPs) and microprocessors, integrated interpolation filters, and a flexible clocking system, which collectively enhance its performance and ease of integration into various systems.

AD9777BSV Applications

  • Telecommunications Infrastructure: Utilized in transceiver modules for converting digital baseband signals into analog signals, enhancing signal transmission over various media.
  • Wireless Base Stations: Acts as a core component in the signal chain, facilitating the generation of high-frequency signals required for efficient data transmission.
  • Medical Imaging Systems: Used in medical devices to process complex signal data, ensuring precise imaging and diagnostics.
  • Test and Measurement Equipment: Critical in generating accurate test signals that mimic real-world conditions, allowing for detailed testing and analysis.
  • High-end Audio Systems: Provides high-resolution audio signal conversion, ensuring superior sound quality and fidelity in professional audio equipment.
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