95293-401-09LF

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Mfr.Part #
95293-401-09LF
Manufacturer
Amphenol Communications Solutions
Package / Case
Datasheet
Download
Description
CONN HEADER SMD 9POS 2.54MM
Stock
33,064
In Stock :
33,064

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Manufacturer :
Amphenol Communications Solutions
Product Category :
Headers, Male Pins
Mount :
Surface Mount
Pitch :
2.54mm
Mounting Type :
Surface Mount
Insulation Material :
Thermoplastic
Housing Color :
Black
Termination :
Solder
Contact Plating :
Tin
Contact Finish - Mating :
Tin
Length :
22.86mm
Contact Length - Mating :
0.230 5.84mm
Orientation :
Straight
Shrouding :
Unshrouded
Number of Positions Loaded :
All
Material Flammability Rating :
UL94 V-0
Max Voltage Rating (AC) :
1.5kV
Number of Positions :
9
Color :
Black
Number of Rows :
1
Packaging :
Bulk
Min Operating Temperature :
-65°C
Max Operating Temperature :
125°C
Pitch - Mating :
0.100 2.54mm
Insulation Height :
0.100 2.54mm
Fastening Type :
Push-Pull
Contact Finish Thickness - Post :
78.7μin 2.00μm
RoHS Status :
RoHS Compliant
Depth :
2.4mm
Contact Finish - Post :
Tin
Insulation Color :
Black
Contact Material :
Phosphor Bronze
Style :
Board to Board
Housing Material :
Thermoplastic
Factory Lead Time :
8 Weeks
Contact Shape :
Square
Contact Finish Thickness - Mating :
78.7μin 2.00μm
Number of Contacts :
9
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Series :
BERGSTIK®
Contact Type :
Male Pin
Connector Type :
Header, Breakaway
Datasheets
95293-401-09LF
Introducing Headers, Male Pins Amphenol Communications Solutions 95293-401-09LF from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, 95293-401-09LF pinout, 95293-401-09LF datasheet PDF, 95293-401-09LF amp .Beyond Headers, Male Pins Amphenol Communications Solutions 95293-401-09LF ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.

Amphenol Communications Solutions 95293-401-09LF


BERGSTIK® Series 1-Row Header, Breakaway Solder Phosphor Bronze Bulk Surface Mount Tin Thermoplastic 9-Position Board to Board 0.100 2.54mm Height

95293-401-09LF Overview


Packaging is Header, Breakaway.Surface Mount is the mounting type.Packaging for the product is carried out via a Bulk case.As a product of the BERGSTIK® Series, it can be found in this category.Temperatures below 125°C are best for using it.There's a minimum temperature of -65°C for this device.In this case, Surface Mount mounts the part.

95293-401-09LF Features


BERGSTIK® series


95293-401-09LF Applications


There are a lot of Amphenol ICC (FCI)
95293-401-09LF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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