93690-103-16
- Mfr.Part #
- 93690-103-16
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 16POS 2.54MM
- Stock
- 20,284
- In Stock :
- 20,284
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- Headers, Male Pins
- Contact Length - Post :
- 0.177 4.50mm
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Housing Color :
- Black
- Housing Material :
- Thermoplastic
- Packaging :
- Bulk
- Number of Rows :
- 2
- Connector Type :
- Header, Breakaway
- Number of Positions Loaded :
- All
- Voltage - Rated :
- 1.5kV
- Number of Positions :
- 16
- Mount :
- Through Hole
- Material Flammability Rating :
- UL94 V-0
- Contact Plating :
- GXT, Gold
- Contact Length - Mating :
- 0.224 5.70mm
- Style :
- Board to Board or Cable
- Series :
- BERGSTIK®
- Current Rating :
- 3A
- Factory Lead Time :
- 8 Weeks
- Fastening Type :
- Push-Pull
- Contact Shape :
- Square
- Overall Contact Length :
- 0.505 12.83mm
- Contact Finish - Mating :
- Gold, GXT™
- RoHS Status :
- RoHS Compliant
- Contact Material :
- COPPER ALLOY
- Number of Contacts :
- 16
- Pitch - Mating :
- 0.100 2.54mm
- Pitch :
- 2.54mm
- Contact Type :
- Male Pin
- Color :
- Black
- Insulation Color :
- Black
- Lead Length :
- 4.7mm
- Termination :
- Press-Fit, Solder
- Contact Gender :
- Male
- Insulation Resistance :
- 5GOhm
- Contact Finish Thickness - Post :
- 39.4μin 1.00μm
- Depth :
- 4.83mm
- Length :
- 20.32mm
- Mating Post Length :
- 5.68mm
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Insulation Height :
- 0.100 2.54mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Insulation Material :
- Thermoplastic
- Contact Finish - Post :
- Tin
- Mounting Type :
- Through Hole
- Orientation :
- Straight
- Shrouding :
- Unshrouded
- Datasheets
- 93690-103-16

BERGSTIK® Series 2-Row Header, Breakaway Press-Fit, Solder Copper Alloy Bulk Through Hole Gold, GXT™ Thermoplastic 16-Position Board to Board or Cable 0.100 2.54mm Height
93690-103-16LF Overview
Currently, it is packaged in Header, Breakaway.The mounting type of the device is Through Hole.A Bulk case is used to package the product.A product of the BERGSTIK® Series, it belongs to the range of products of that series.Through Hole represents the mounting point for the part.
93690-103-16LF Features
BERGSTIK® series
93690-103-16LF Applications
There are a lot of Amphenol ICC (FCI)
93690-103-16LF Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















