896-050-540-803

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Mfr.Part #
896-050-540-803
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 50POS 0.125
Stock
12,341
In Stock :
12,341

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Number of Positions :
50
Contact Finish Thickness :
10.0µin (0.25µm)
Product Status :
Active
Card Type :
Non Specified - Dual Edge
Color :
Black
Base Product Number :
896-050
Gender :
FEMALE
Pitch :
0.125 (3.18mm)
Contact Finish :
Gold
Material - Insulation :
Polyphenylene Sulfide (PPS)
Contact Type :
Cantilever
Package :
Bulk
Contact Material :
COPPER ALLOY
Mounting Angle :
Vertical
Mounting Type :
Through Hole
Flange Feature :
Top Mount Opening, Floating Bobbin, 0.116 (2.95mm) Dia
Housing Material :
Polyphenylene Sulfide (PPS)
Number of Rows :
2
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Series :
896
Board Thickness :
1.57 mm
Read Out :
Dual
Features :
-
Operating Temperature :
-40°C ~ 125°C
Contact Plating :
Gold
Product :
Receptacles
Number of Positions/Bay/Row :
25
Termination :
Wire Wrap
Mounting Style :
Panel Mount
Datasheets
896-050-540-803
Introducing Edgeboard Connectors EDAC Inc. 896-050-540-803 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-40°C ~ 125°C, 896-050-540-803 pinout, 896-050-540-803 datasheet PDF, 896-050-540-803 amp .Beyond Edgeboard Connectors EDAC Inc. 896-050-540-803 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 896-050-540-803


Female Black 0.125 (3.18mm) Copper Alloy 2 Rows Wire Wrap Gold 50 Positions Polyphenylene Sulfide (PPS)

896-050-540-803 Overview


It's best to mount type Through Hole.The 896 indicates the series number of the device.

896-050-540-803 Features


896 series


896-050-540-803 Applications


There are a lot of EDAC
896-050-540-803 Edgeboard Connectors applications.


  • RADAR processing, digital oscilloscopes
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
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