86832-108HLF

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Mfr.Part #
86832-108HLF
Manufacturer
Amphenol Communications Solutions
Package / Case
Datasheet
Download
Description
CONN HEADER VERT 8POS 2.54MM
Stock
23,500
In Stock :
23,500

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Manufacturer :
Amphenol Communications Solutions
Product Category :
Headers, Male Pins
Contact Material :
Phosphor Bronze
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mounting Type :
Through Hole
Number of Rows :
2
Current Rating :
3A
Number of Positions :
8
Insulation Color :
Black
RoHS Status :
RoHS Compliant
Pitch :
2.54mm
Contact Plating :
GXT, Gold
Material Flammability Rating :
UL94 V-0
Fastening Type :
Push-Pull
Contact Gender :
Male
Lead Length :
2.54mm
Contact Length - Mating :
0.325 8.26mm
Number of Contacts :
8
Housing Material :
Thermoplastic
Overall Contact Length :
0.525 13.34mm
Contact Finish Thickness - Mating :
30.0μin 0.76μm
Mount :
Through Hole
Contact Finish - Mating :
Gold or Gold, GXT™
Radiation Hardening :
No
Row Spacing - Mating :
0.100 (2.54mm)
Style :
Board to Board
Insulation Height :
0.100 2.54mm
Voltage - Rated :
1.5kV
Termination :
Solder
Number of Positions Loaded :
All
Contact Length - Post :
0.100 2.54mm
Contact Type :
Male Pin
Min Operating Temperature :
-65°C
Pitch - Mating :
0.100 2.54mm
Shrouding :
Unshrouded
Series :
BERGSTIK® II
Flammability Rating :
UL94 V-0
Packaging :
Bulk
Color :
Black
Insulation Resistance :
5GOhm
Max Operating Temperature :
125°C
Connector Type :
Header
Mating Post Length :
8.26mm
Contact Shape :
Square
Datasheets
86832-108HLF
Introducing Headers, Male Pins Amphenol Communications Solutions 86832-108HLF from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, 86832-108HLF pinout, 86832-108HLF datasheet PDF, 86832-108HLF amp .Beyond Headers, Male Pins Amphenol Communications Solutions 86832-108HLF ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.

Amphenol Communications Solutions 86832-108HLF


BERGSTIK® II Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold or Gold, GXT™ 8-Position Board to Board 0.100 2.54mm Height

86832-108HLF Overview


This product is packaged in a Header cartonThis device's mounting type is Through Hole.It's packaged in a Bulk case.BERGSTIK® II Series product.The best time to use this device is when the temperature is below 125°C.It has to be at least -65°C degrees to work.Through Hole is mounting the part.

86832-108HLF Features


BERGSTIK® II series


86832-108HLF Applications


There are a lot of Amphenol ICC (FCI)
86832-108HLF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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