857-039-545-104

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Mfr.Part #
857-039-545-104
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE SGL FMALE 39POS 0.156
Stock
41,820
In Stock :
41,820

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Gender :
FEMALE
Features :
-
Series :
857
Pitch :
0.156 (3.96mm)
Board Thickness :
1.57 mm
Product Status :
Active
Flange Feature :
Flush Mount, Top Opening, Unthreaded, 0.156 (3.96mm) Dia
Material - Insulation :
Polyphenylene Sulfide (PPS)
Read Out :
Single
Contact Finish Thickness :
10.0µin (0.25µm)
Color :
Black
Product :
Receptacles
Operating Temperature :
-40°C ~ 125°C
Card Type :
Non Specified - Single Edge
Termination :
Wire Wrap
Contact Plating :
Gold
Number of Positions/Bay/Row :
39
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Housing Material :
Polyphenylene Sulfide (PPS)
Number of Rows :
1
Contact Finish :
Gold
Contact Material :
COPPER ALLOY
Contact Type :
Semi Bellows
Mounting Type :
Through Hole
Package :
Bulk
Number of Positions :
39
Mounting Style :
Panel Mount
Mounting Angle :
Vertical
Base Product Number :
857-039
Datasheets
857-039-545-104
Introducing Edgeboard Connectors EDAC Inc. 857-039-545-104 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 125°C, Mounting Type:Through Hole, 857-039-545-104 pinout, 857-039-545-104 datasheet PDF, 857-039-545-104 amp .Beyond Edgeboard Connectors EDAC Inc. 857-039-545-104 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 857-039-545-104


Female Black 0.156 (3.96mm) Copper Alloy 1 Rows Wire Wrap Gold 39 Positions Polyphenylene Sulfide (PPS)

857-039-545-104 Overview


It's best to mount type Through Hole.The 857 indicates the series number of the device.

857-039-545-104 Features


857 series


857-039-545-104 Applications


There are a lot of EDAC
857-039-545-104 Edgeboard Connectors applications.


  • RADAR processing, digital oscilloscopes
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
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