857-038-501-107

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Mfr.Part #
857-038-501-107
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 76POS 0.156
Stock
24,122
In Stock :
24,122

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Termination :
Solder Eyelet(s)
Mounting Style :
Panel Mount
Housing Material :
Polyphenylene Sulfide (PPS)
Mounting Type :
Through Hole
Contact Plating :
Gold
Gender :
FEMALE
Board Thickness :
1.57 mm
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Contact Material :
COPPER ALLOY
Features :
-
Base Product Number :
857-038
Contact Type :
Semi Bellows
Product Status :
Active
Pitch :
0.156 (3.96mm)
Card Type :
Non Specified - Dual Edge
Material - Insulation :
Polyphenylene Sulfide (PPS)
Contact Finish Thickness :
10.0µin (0.25µm)
Product :
Receptacles
Read Out :
Dual
Package :
Bulk
Flange Feature :
Flush Mount, Top Opening, Threaded Insert, M3
Number of Positions/Bay/Row :
38
Number of Positions :
76
Operating Temperature :
-40°C ~ 125°C
Mounting Angle :
Vertical
Color :
Black
Series :
857
Contact Finish :
Gold
Number of Rows :
2
Datasheets
857-038-501-107
Introducing Edgeboard Connectors EDAC Inc. 857-038-501-107 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-40°C ~ 125°C, 857-038-501-107 pinout, 857-038-501-107 datasheet PDF, 857-038-501-107 amp .Beyond Edgeboard Connectors EDAC Inc. 857-038-501-107 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 857-038-501-107


Female Black 0.156 (3.96mm) Copper Alloy 2 Rows Solder Eyelet(s) Gold 76 Positions Polyphenylene Sulfide (PPS)

857-038-501-107 Overview


The mount type Through Hole is recommended.It indicates the series of the device by the 857.

857-038-501-107 Features


857 series


857-038-501-107 Applications


There are a lot of EDAC
857-038-501-107 Edgeboard Connectors applications.


  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
  • Digital Storage Oscilloscope
  • Scientific instruments.
  • Music reproduction technology
  • Communication Systems
  • Data Acquisition Systems
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