857-033-401-102

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Mfr.Part #
857-033-401-102
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 66POS 0.156
Stock
25,673
In Stock :
25,673

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Material - Insulation :
Polyphenylene Sulfide (PPS)
Contact Type :
Semi Bellows
Housing Material :
Polyphenylene Sulfide (PPS)
Contact Material :
COPPER ALLOY
Mounting Type :
Through Hole
Contact Plating :
Gold
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Mounting Style :
Panel Mount
Color :
Black
Mounting Angle :
Vertical
Termination :
Solder Eyelet(s)
Base Product Number :
857-033
Number of Positions :
66
Contact Finish :
Tin
Number of Positions/Bay/Row :
33
Package :
Bulk
Board Thickness :
1.57 mm
Flange Feature :
Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia
Read Out :
Dual
Product Status :
Active
Gender :
FEMALE
Pitch :
0.156 (3.96mm)
Series :
857
Contact Finish Thickness :
-
Product :
Receptacles
Number of Rows :
2
Features :
-
Card Type :
Non Specified - Dual Edge
Operating Temperature :
-40°C ~ 125°C
Datasheets
857-033-401-102
Introducing Edgeboard Connectors EDAC Inc. 857-033-401-102 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-40°C ~ 125°C, 857-033-401-102 pinout, 857-033-401-102 datasheet PDF, 857-033-401-102 amp .Beyond Edgeboard Connectors EDAC Inc. 857-033-401-102 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 857-033-401-102


Female Black 0.156 (3.96mm) Copper Alloy 2 Rows Solder Eyelet(s) Tin 66 Positions Polyphenylene Sulfide (PPS)

857-033-401-102 Overview


The mounting type Through Hole is recommended.It is indicated by the 857 that the device belongs to a certain series.

857-033-401-102 Features


857 series


857-033-401-102 Applications


There are a lot of EDAC
857-033-401-102 Edgeboard Connectors applications.


  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
  • Digital Storage Oscilloscope
  • Scientific instruments.
  • Music reproduction technology
  • Communication Systems
  • Data Acquisition Systems
  • Handheld Terminal Interface
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