857-029-459-102

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Mfr.Part #
857-029-459-102
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE SGL FML 29POS 0.156
Stock
13,599
In Stock :
13,599

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Package :
Bulk
Material - Insulation :
Polyphenylene Sulfide (PPS)
Base Product Number :
857-029
Gender :
FEMALE
Contact Plating :
Gold
Flange Feature :
Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia
Housing Material :
Polyphenylene Sulfide (PPS)
Product Status :
Active
Termination :
Solder
Mounting Angle :
RIGHT ANGLE
Pitch :
0.156 (3.96mm)
Features :
-
Number of Positions/Bay/Row :
29
Mounting Type :
Through Hole, Right Angle
Contact Finish :
Tin
Contact Material :
COPPER ALLOY
Read Out :
Single
Operating Temperature :
-40°C ~ 125°C
Board Thickness :
1.57 mm
Contact Finish Thickness :
-
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Number of Positions :
29
Card Type :
Non Specified - Single Edge
Product :
Receptacles
Mounting Style :
Panel Mount
Series :
857
Number of Rows :
1
Contact Type :
Semi Bellows
Color :
Black
Datasheets
857-029-459-102
Introducing Edgeboard Connectors EDAC Inc. 857-029-459-102 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Right Angle, Operating Temperature:-40°C ~ 125°C, 857-029-459-102 pinout, 857-029-459-102 datasheet PDF, 857-029-459-102 amp .Beyond Edgeboard Connectors EDAC Inc. 857-029-459-102 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 857-029-459-102


Female Black 0.156 (3.96mm) Copper Alloy 1 Rows Solder Tin 29 Positions Polyphenylene Sulfide (PPS)

857-029-459-102 Overview


It's best to mount type Through Hole, Right Angle.The 857 indicates the series number of the device.

857-029-459-102 Features


857 series


857-029-459-102 Applications


There are a lot of EDAC
857-029-459-102 Edgeboard Connectors applications.


  • RADAR processing, digital oscilloscopes
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
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