857-024-400-202

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Mfr.Part #
857-024-400-202
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 24POS 0.156
Stock
28,184
In Stock :
28,184

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Contact Finish Thickness :
-
Number of Rows :
2
Mounting Angle :
Vertical
Card Type :
Non Specified - Dual Edge
Termination :
Solder Eyelet(s)
Series :
857
Contact Finish :
Tin
Number of Positions/Bay/Row :
12
Pitch :
0.156 (3.96mm)
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Product Status :
Active
Features :
-
Package :
Bulk
Housing Material :
Polyphenylene Sulfide (PPS)
Base Product Number :
857-024
Board Thickness :
1.57 mm
Contact Material :
COPPER ALLOY
Mounting Style :
Panel Mount
Contact Plating :
Gold
Mounting Type :
Through Hole
Flange Feature :
Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia
Product :
Receptacles
Material - Insulation :
Polyphenylene Sulfide (PPS)
Contact Type :
Semi Bellows
Number of Positions :
24
Color :
Black
Operating Temperature :
-40°C ~ 125°C
Gender :
FEMALE
Read Out :
Dual
Datasheets
857-024-400-202
Introducing Edgeboard Connectors EDAC Inc. 857-024-400-202 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-40°C ~ 125°C, 857-024-400-202 pinout, 857-024-400-202 datasheet PDF, 857-024-400-202 amp .Beyond Edgeboard Connectors EDAC Inc. 857-024-400-202 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 857-024-400-202


Female Black 0.156 (3.96mm) Copper Alloy 2 Rows Solder Eyelet(s) Tin 24 Positions Polyphenylene Sulfide (PPS)

857-024-400-202 Overview


It's best to mount type Through Hole.The 857 indicates the series number of the device.

857-024-400-202 Features


857 series


857-024-400-202 Applications


There are a lot of EDAC
857-024-400-202 Edgeboard Connectors applications.


  • RADAR processing, digital oscilloscopes
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
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