857-017-405-102

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Mfr.Part #
857-017-405-102
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE SGL FML 17POS 0.156
Stock
44,647
In Stock :
44,647

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Contact Material :
COPPER ALLOY
Termination :
Solder Eyelet(s)
Housing Material :
Polyphenylene Sulfide (PPS)
Features :
-
Product Status :
Active
Card Type :
Non Specified - Single Edge
Number of Positions :
17
Flange Feature :
Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia
Package :
Bulk
Contact Finish Thickness :
-
Gender :
FEMALE
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Mounting Angle :
Vertical
Color :
Black
Board Thickness :
1.57 mm
Number of Rows :
1
Base Product Number :
857-017
Mounting Type :
Through Hole
Read Out :
Single
Contact Type :
Semi Bellows
Material - Insulation :
Polyphenylene Sulfide (PPS)
Product :
Receptacles
Pitch :
0.156 (3.96mm)
Mounting Style :
Panel Mount
Operating Temperature :
-40°C ~ 125°C
Contact Finish :
Tin
Number of Positions/Bay/Row :
17
Series :
857
Contact Plating :
Gold
Datasheets
857-017-405-102
Introducing Edgeboard Connectors EDAC Inc. 857-017-405-102 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-40°C ~ 125°C, 857-017-405-102 pinout, 857-017-405-102 datasheet PDF, 857-017-405-102 amp .Beyond Edgeboard Connectors EDAC Inc. 857-017-405-102 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 857-017-405-102


Female Black 0.156 (3.96mm) Copper Alloy 1 Rows Solder Eyelet(s) Tin 17 Positions Polyphenylene Sulfide (PPS)

857-017-405-102 Overview


It's best to mount type Through Hole.The 857 indicates the series number of the device.

857-017-405-102 Features


857 series


857-017-405-102 Applications


There are a lot of EDAC
857-017-405-102 Edgeboard Connectors applications.


  • RADAR processing, digital oscilloscopes
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
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