807-041-457-107

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Mfr.Part #
807-041-457-107
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 82POS 0.156
Stock
12,529
In Stock :
12,529

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Housing Material :
Diallyl Phthalate (DAP)
Board Thickness :
1.57 mm
Features :
-
Product Status :
Active
Number of Positions/Bay/Row :
41
Number of Positions :
82
Color :
Green
Gender :
FEMALE
Operating Temperature :
-40°C ~ 125°C
Contact Type :
Semi Bellows
Read Out :
Dual
Number of Rows :
2
Base Product Number :
807-041
Product :
Receptacles
Pitch :
0.156 (3.96mm)
Termination :
Solder
Contact Finish Thickness :
-
Contact Plating :
Gold
Contact Material :
COPPER ALLOY
Package :
Bulk
Series :
807
Mounting Style :
Panel Mount
Material - Insulation :
Diallyl Phthalate (DAP)
Mounting Type :
Through Hole, Right Angle
Contact Finish :
Tin
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Card Type :
Non Specified - Dual Edge
Flange Feature :
Flush Mount, Top Opening, Threaded Insert, M3
Mounting Angle :
RIGHT ANGLE
Datasheets
807-041-457-107
Introducing Edgeboard Connectors EDAC Inc. 807-041-457-107 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 125°C, Mounting Type:Through Hole, Right Angle, 807-041-457-107 pinout, 807-041-457-107 datasheet PDF, 807-041-457-107 amp .Beyond Edgeboard Connectors EDAC Inc. 807-041-457-107 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 807-041-457-107


Female Green 0.156 (3.96mm) Copper Alloy 2 Rows Solder Tin 82 Positions Diallyl Phthalate (DAP)

807-041-457-107 Overview


It's best to mount type Through Hole, Right Angle.The 807 indicates the series number of the device.

807-041-457-107 Features


807 series


807-041-457-107 Applications


There are a lot of EDAC
807-041-457-107 Edgeboard Connectors applications.


  • RADAR processing, digital oscilloscopes
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
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